Abstract:
A semiconductor structure comprising a substrate including a first layer comprising a first material having a first modulus of elasticity; a first structure comprising a conductor and formed within the substrate, the first structure having an upper surface; and a stress diverting structure proximate the first structure and within the first layer, the stress diverting structure providing a low mechanical stress region at the upper surface of the first structure when a physical load is applied to the first structure, wherein said low mechanical stress region comprises stress values below the stress values in areas not protected by the stress diverting structure. The stress diverting structure comprises a second material having a second modulus of elasticity less than the first modulus of elasticity, the second material selectively formed over the upper surface of the first structure for diverting mechanical stress created by the physical load applied to the first structure.
Abstract:
A transimpedance amplifier for a high-speed optical fiber communication receiver includes an operational amplifier having a current input and developing a voltage output. A variable peaking capacitor is connected across the operational amplifier. A control circuit is operatively coupled to the variable capacitor for controlling capacitance to widen bandwidth of the transimpedance amplifier.
Abstract:
An infrared (IR) transceiver having a receiver chain with an isolated analog output, includes a transmission gate and a unity gain buffer interposed between the amplifier output and an analog output pad. The transmission gate behaves as a switch, passing the analog output signal to the analog output pad only when an analog output is required. The unity gain buffer has a high input resistance, a low input capacitance, a unity gain and a low output impedance, so that the load of a digital signal processing (DSP) device or measuring instrument on the analog output pad is isolated and does not affect the performance of the receiver chain. Since the transfer rates of the transmission gate and the buffer are each unity, the analog output pad provides a high fidelity analog output signal to the output buffer.