公开(公告)号：US07694649B2

公开(公告)日：2010-04-13

申请号：US11472358

申请日：2006-06-22

申请人： Yoshio Kimura ,  Takahiro Okubo

发明人： Yoshio Kimura ,  Takahiro Okubo

IPC分类号： B05C11/00 ,  B05C13/02 ,  B05B7/06 ,  B05B17/00

CPC分类号： H01L21/67178 ,  H01L21/67184 ,  H01L21/6719

摘要： A process system includes a plurality of processing modules each processing a substrate with a process liquid. There is disposed a dispensing mechanism that dispenses the process liquid to the vertically arranged modules. The dispensing mechanism is provided with a process liquid supply source, and pumps corresponding to the respective processing modules. Each pump temporarily stores therein the process liquid which has been pressure-fed through a riser piping from the process liquid supply source by a pressing apparatus, and delivers the process liquid from an outlet. There are disposed nozzles each having a discharge port and discharging the process liquid to the corresponding processing module. Delivery pipings connecting the outlets of the pumps with the discharge ports of the corresponding nozzles have identical length to each other.

摘要翻译： 处理系统包括多个处理模块，每个处理模块用处理液处理衬底。 设置了将处理液体分配给垂直排列的模块的分配机构。 分配机构设置有处理液体供应源和对应于各个处理模块的泵。 每个泵临时存储已经通过加压装置从处理液体供给源通过提升管道进给的处理液体，并且从出口输送处理液体。 设有各自具有排出口并且将处理液体排出到相应的处理模块的喷嘴。 将泵的出口与相应喷嘴的排出口连接的输送管道彼此具有相同的长度。

公开(公告)号：US07648292B2

公开(公告)日：2010-01-19

申请号：US11831622

申请日：2007-07-31

申请人： Kunie Ogata ,  Koki Nishimuko ,  Hiroshi Tomita ,  Yoshio Kimura ,  Ryouichi Uemura ,  Michio Tanaka

发明人： Kunie Ogata ,  Koki Nishimuko ,  Hiroshi Tomita ,  Yoshio Kimura ,  Ryouichi Uemura ,  Michio Tanaka

IPC分类号： G03D5/00 ,  G03B27/32

摘要： A resist pattern forming method using a coating and developing apparatus and an aligner being connected thereto which are controlled to form a resist film on a surface of a substrate with a base film and a base pattern formed thereon, followed by inspecting at least one of a plurality of measurement items selected from: reflection ratio and film thickness of the base film and the resist film, line width after a development, an accuracy that the base pattern matches with a resist pattern, a defect on the surface after the development, etc. A parameter subject to amendment is selected based on corresponding data of each measurement item, such as the film thickness of the resist and the line width after the development, and amendment of the parameter is performed. This results in a reduced workload of an operator, and the appropriate amendment can be performed.

公开(公告)号：US20090103124A1

公开(公告)日：2009-04-23

申请号：US12065143

申请日：2006-08-29

申请人： Yoshio Kimura ,  Junko Nemoto ,  Wilson Chiu ,  Andrew Daborn ,  Yuan Shao

发明人： Yoshio Kimura ,  Junko Nemoto ,  Wilson Chiu ,  Andrew Daborn ,  Yuan Shao

IPC分类号： G06F3/12 ,  H04B7/00

CPC分类号： G06F3/1209 ,  G06F3/1204 ,  G06F3/1222 ,  G06F3/1232 ,  G06F3/1238 ,  G06F3/1292 ,  H04W8/005 ,  H04W76/14 ,  H04W84/18

摘要： This invention further improves the operability of a mobile device by changing the operation screen of the mobile device in accordance with the operation status of the mobile device or that of an image forming apparatus in a communicable state when the mobile device and image forming apparatus become communicable with each other. When it is detected that the mobile device exists within a range of a predetermined short distance, status information is acquired from the mobile device to determine whether a file is selected in the operation screen of the mobile device. Information which designates an operation screen to be displayed on the mobile device is transmitted on the basis of the determination result.

摘要翻译： 本发明通过在移动设备和图像形成设备变得可通信时根据移动设备的操作状态或处于可通信状态的图像形成设备的操作状态来改变移动设备的操作屏幕来进一步提高可操作性 与彼此。 当检测到移动设备存在于预定短距离的范围内时，从移动设备获取状态信息，以确定在移动设备的操作屏幕中是否选择了文件。 基于确定结果发送指定要在移动装置上显示的操作画面的信息。

公开(公告)号：US07488127B2

公开(公告)日：2009-02-10

申请号：US11199215

申请日：2005-08-09

申请人： Kunie Ogata ,  Koki Nishimuko ,  Hiroshi Tomita ,  Yoshio Kimura ,  Ryouichi Uemura ,  Michio Tanaka

发明人： Kunie Ogata ,  Koki Nishimuko ,  Hiroshi Tomita ,  Yoshio Kimura ,  Ryouichi Uemura ,  Michio Tanaka

IPC分类号： G03D5/00 ,  G03B13/00 ,  G03B27/32

CPC分类号： H01L21/67253 ,  G03F7/162 ,  G03F7/3021 ,  H01L21/6715

摘要： A resist pattern forming apparatus comprising a controller having a controlling portion that controls a processing of a coating and developing apparatus with a coating unit and a developing unit being provided therewith and an aligner being connected thereto, while an inspecting portion and the like measures at least one of a plurality of measurement items selected from, a reflection ratio and a film thickness of a base film and a resist film, a line width after the development, an accuracy that the base film matches with a resist pattern, a defect after the development, and so on. The measured data is transmitted to the controller. At the controller, a parameter subject to an amendment is selected based on the corresponding data of each of the measurement item such as the film thickness of the resist and the line width after the development, and the amendment of the parameters subject to the amendment is performed. As a result, the amending operation is facilitated by a reduced workload of an operator and in the same time, the appropriate amendment can be performed.

公开(公告)号：US20080041465A1

公开(公告)日：2008-02-21

申请号：US11889464

申请日：2007-08-13

申请人： Yoshio Kimura

发明人： Yoshio Kimura

IPC分类号： F16K24/00

CPC分类号： G03F7/162 ,  G03F7/30 ,  Y10T137/86324

摘要： A buffer tank for use in a liquid treatment apparatus applying a liquid treatment to a substrate surface by supplying thereto a treating liquid from a nozzle, the buffer tank is provided in a flow path of the treating liquid from a supply tank of the liquid to the nozzle, the buffer tank including an inlet port for introducing the treating liquid supplied from the supply tank into a buffer tank body, a first accumulation region in the buffer tank body for holding the treating liquid introduced into the buffer tank, a first vent port for discharging bubbles accumulated in the first accumulation region, a filter through which the treating liquid in the first accumulation region passes, the filter filtering the treating liquid, and a supplying port for supplying the treating liquid filtered with the filter to the nozzle.

摘要翻译： 一种用于液体处理装置的缓冲罐，其通过从喷嘴向其提供处理液体而将液体处理应用于基板表面，所述缓冲罐设置在所述处理液体从所述液体的供给槽到所述液体的流路中 所述缓冲罐包括用于将从所述供应罐供给的处理液引入缓冲罐体的入口，所述缓冲罐主体中的用于保持引入到所述缓冲罐中的处理液的第一积存区域， 排出积存在第一积聚区域中的气泡，第一积聚区域中的处理液通过的过滤器，过滤器处理液体的过滤器;以及用于将经过滤器的处理液体供给到喷嘴的供给口。

公开(公告)号：US07245348B2

公开(公告)日：2007-07-17

申请号：US11117566

申请日：2005-04-29

申请人： Masami Akimoto ,  Shinichi Hayashi ,  Yasushi Hayashida ,  Nobuaki Matsuoka ,  Yoshio Kimura ,  Issei Ueda ,  Hikaru Ito

发明人： Masami Akimoto ,  Shinichi Hayashi ,  Yasushi Hayashida ,  Nobuaki Matsuoka ,  Yoshio Kimura ,  Issei Ueda ,  Hikaru Ito

IPC分类号： G03B27/52

CPC分类号： H01L21/67184 ,  H01L21/6715 ,  H01L21/67178 ,  H01L21/6719

摘要： A coating and developing system includes an auxiliary block, a resist film forming unit block and antireflection film forming unit blocks stacked up in layers to form a resist film and an antireflection film underlying the resist film and an antireflection film overlying the resist film in a small space. The coating and developing system can cope with either a case where antireflection films are formed or a case where no antireflection film is formed. Film forming unit blocks, namely, a TCT layer, a COT layer and a BCT layer, and developing unit blocks, namely, DEV layers, are stacked up in layers in a processing block S2. The TCT layer, the COT layer and the BCT layer are used selectively in the case where antireflection films are formed and the case where any antireflection film is not formed. The coating and developing system is controlled by a carrying program.

摘要翻译： 涂覆显影系统包括辅助块，抗蚀剂膜形成单元块和层叠的抗反射膜形成单元块，以形成抗蚀剂膜和抗蚀剂膜下面的抗反射膜，以及抗反射膜，覆盖抗蚀剂膜 空间。 涂覆和显影系统可以应对形成防反射膜的情况或不形成抗反射膜的情况。 成膜单位块，即TCT层，COT层和BCT层，以及显影单元块，即DEV层，在处理块S2中层叠。 在形成防反射膜的情况下选择性地使用TCT层，COT层和BCT层以及未形成任何抗反射膜的情况。 涂层和显影系统由携带程序控制。

公开(公告)号：US20070117400A1

公开(公告)日：2007-05-24

申请号：US10582239

申请日：2004-11-11

申请人： Nobuaki Matsuoka ,  Yoshio Kimura

发明人： Nobuaki Matsuoka ,  Yoshio Kimura

IPC分类号： H01L21/31

CPC分类号： H01L21/67173 ,  H01L21/6715 ,  H01L21/67178 ,  H01L21/67184

摘要： A substrate processing apparatus capable of readily addressing an increase/decrease in quantity of substrates to be processed and a change in type thereof. The substrate processing apparatus includes a carrier block having a first transfer device performing delivery of the substrate with respect to a substrate carrier on a carrier placement portion, a transfer block provided adjacent to the carrier block and having a second transfer device, a first delivery stage performing delivery of the substrate between the first transfer device and the second transfer device, and a plurality of process blocks freely attachable/detachable with respect to the transfer block. Since the process blocks perform a series of processing on the substrate in units of the process blocks, it is readily possible to address considerable increase/decrease in quantity of processed substrates by attaching/detaching the process block(s), and to address the different change in type thereof by changing the process block(s).

摘要翻译： 能够容易地解决待处理基板的数量的增减的基板处理装置及其类型的变化。 基板处理装置包括载体块，该载体块具有相对于载体放置部分上的基板载体执行基板传送的第一传送装置，邻近载体块设置的传送块，并具有第二传送装置，第一传送级 在第一传送装置和第二传送装置之间执行基板的传送，以及可相对于传送块自由地安装/拆卸的多个处理块。 由于处理块以处理块为单位对衬底进行一系列处理，因此可以通过附加/分离处理块来解决处理衬底的数量的显着增加/减少，并且解决不同的处理块 通过改变处理块来改变其类型。

公开(公告)号：US20070095278A1

公开(公告)日：2007-05-03

申请号：US11472358

申请日：2006-06-22

申请人： Yoshio Kimura ,  Takahiro Okubo

发明人： Yoshio Kimura ,  Takahiro Okubo

IPC分类号： B05C11/00 ,  C23C16/52 ,  B05D1/02

CPC分类号： H01L21/67178 ,  H01L21/67184 ,  H01L21/6719

摘要： A process system includes a plurality of processing modules each processing a substrate with a process liquid. There is disposed a dispensing mechanism that dispenses the process liquid to the vertically arranged modules. The dispensing mechanism is provided with a process liquid supply source, and pumps corresponding to the respective processing modules. Each pump temporarily stores therein the process liquid which has been pressure-fed through a riser piping from the process liquid supply source by a pressing apparatus, and delivers the process liquid from an outlet. There are disposed nozzles each having a discharge port and discharging the process liquid to the corresponding processing module. Delivery pipings connecting the outlets of the pumps with the discharge ports of the corresponding nozzles have identical length to each other.

摘要翻译： 处理系统包括多个处理模块，每个处理模块用处理液处理衬底。 设置了将处理液体分配给垂直排列的模块的分配机构。 分配机构设置有处理液体供应源和对应于各个处理模块的泵。 每个泵临时存储已经通过加压装置从处理液体供给源通过提升管道进给的处理液体，并且从出口输送处理液体。 设有各自具有排出口并且将处理液体排出到相应的处理模块的喷嘴。 将泵的出口与相应喷嘴的排出口连接的输送管道彼此具有相同的长度。

公开(公告)号：US20070074745A1

公开(公告)日：2007-04-05

申请号：US11529504

申请日：2006-09-29

申请人： Yoshio Kimura ,  Kouzou Kanagawa

发明人： Yoshio Kimura ,  Kouzou Kanagawa

IPC分类号： B08B6/00 ,  B08B7/00 ,  H01L21/00

CPC分类号： H01L21/67225

摘要： Disclosed is an exhaust system for discharging a fluid which is supplied into a hermetically closed container 54 for containing a semiconductor wafer W, a substrate to be supplied in the container 54 and subjected to a process. The exhaust system comprises an outer exhaust pipe 71 which is connected to the hermetically closed container via an exhaust connecting pipe 68 and has closed top and bottom ends, a downstream guide passage 201 which is provided in the outer exhaust pipe 71 and adapted to downwardly guide an exhaust fluid flowing through the outer exhaust pipe 71, and an upstream guide passage 202 which is adapted to upwardly guide the exhaust fluid having flowed through the downstream guide passage 201 as well as to cause foreign matter or the like in the exhaust fluid to be settled by gravity. The exhaust fluid having flowed through the upstream guide passage 202 is discharged from a discharging passage 203 to the outside.

摘要翻译： 公开了一种用于排出供给到用于容纳半导体晶片W的密封容器54中的流体的排气系统，将被供给到容器54中并进行处理的基板。 排气系统包括外排气管71，其通过排气连接管68连接到密封容器，并且具有封闭的顶端和底端，下游引导通道201设置在外排气管71中并适于向下引导 流经外排气管71的废气流体，以及上游引导通道202，其适于向上引导已流过下游引导通道201的排出流体，并使排气流体中的异物等引起 通过重力沉降。 已经流过上游引导通道202的排出流体从排放通道203排出到外部。

公开(公告)号：US20070074457A1

公开(公告)日：2007-04-05

申请号：US11540835

申请日：2006-09-29

申请人： Takashi Ito ,  Yoshio Kimura

发明人： Takashi Ito ,  Yoshio Kimura

IPC分类号： B24D3/02

CPC分类号： H01L21/31053 ,  C09G1/02

摘要： A polishing composition contains silica abrasive grains having an average particle size of 20 to 100 nm, an alkali selected from the group consisting of ammonia, ammonium salts, alkali metal salts, and alkali metal hydroxides, and a silicone oil having an HLB value greater than or equal to 8. The polishing composition is suitable for use in an application for polishing an object to be polished.

摘要翻译： 抛光组合物含有平均粒径为20-100nm的二氧化硅磨料颗粒，选自氨，铵盐，碱金属盐和碱金属氢氧化物的碱，和HLB值大于 或等于8.抛光组合物适用于抛光待抛光物体的应用。