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15 条记录 (耗时 0.013 秒)

    ELECTRONIC ASSEMBLY WITH RFI SHIELDING
    12.
    发明申请
    ELECTRONIC ASSEMBLY WITH RFI SHIELDING 审中-公开

    公开(公告)号：US20180310441A1

    公开(公告)日：2018-10-25

    申请号：US15847947

    申请日：2017-12-20

    申请人： Chin-Hsien Chang ,  Shang-Chu Chien ,  Ting-Tuan Chang ,  Chi-Chu Chen

    发明人： Chin-Hsien Chang ,  Shang-Chu Chien ,  Ting-Tuan Chang ,  Chi-Chu Chen

    IPC分类号： H05K9/00 ,  H05K1/02

    CPC分类号： H05K9/0024 ,  H05K1/0243 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10371

    摘要： An electronic assembly with RFI shielding including a circuit board, a high frequency electromagnetic radiation device, and a shielding cover is provided. The circuit board includes a connector. The high frequency electromagnetic radiation device is detachably inserted to the connector of the circuit board to be electrically connected with the circuit board. The shielding cover is detachably assembled to the connector to be opened or closed relative to the circuit board. The shielding cover shields high frequency radiation generated by the high frequency electromagnetic radiation device when the shielding cover is in a closed state, and at least a portion of the shielding cover contacts the circuit board in the closed state, and the shielding cover is electrically connected to a grounding portion of the circuit board via the connector.

    Cover module of electronic device and control method thereof
    13.
    发明授权
    Cover module of electronic device and control method thereof 失效
    电子装置盖模块及其控制方法

    公开(公告)号：US07704085B1

    公开(公告)日：2010-04-27

    申请号：US12497539

    申请日：2009-07-02

    申请人： Chin-Hsien Chang

    发明人： Chin-Hsien Chang

    IPC分类号： H01R13/44

    CPC分类号： H01R13/447 ,  H01R13/506

    摘要： A cover module of an electronic device and a control method thereof are provided. The cover module includes a body, a flexible connecting element, and a flip cover. The body has an opening exposing the connector. A sidewall of the opening has a first fixing structure. The flip cover is in the opening, and a sidewall of the flip cover has a second fixing structure locked with the first fixing structure. The flexible connecting element is connected between the body and the flip cover. When a force is applied to the flip cover, the flexible connecting element is deformed, the flip cover moves with the deformation of the flexible connecting element, and the locking between the first and the second fixing structures is released to cause the flip cover swinging open away from the body with a part of the flexible connecting element as an axis.

    摘要翻译： 提供电子设备的盖模块及其控制方法。 盖模块包括主体，柔性连接元件和翻盖。 主体具有露出连接器的开口。 开口的侧壁具有第一固定结构。 翻盖位于开口中，翻盖的侧壁具有与第一固定结构锁定的第二固定结构。 柔性连接元件连接在主体和翻盖之间。 当将力施加到翻盖时，柔性连接元件变形，翻盖随柔性连接元件的变形而移动，第一固定结构和第二固定结构之间的锁定被释放，以使翻盖开启 远离身体，其中柔性连接元件的一部分作为轴线。

    Electronic device and assembling method of electronic device
    14.
    发明授权
    Electronic device and assembling method of electronic device 有权

    公开(公告)号：US10963021B2

    公开(公告)日：2021-03-30

    申请号：US16453997

    申请日：2019-06-26

    申请人： Chin-Hsien Chang ,  Yen-Chia Chang

    发明人： Chin-Hsien Chang ,  Yen-Chia Chang

    IPC分类号： G06F1/16 ,  G06F3/16 ,  G06F3/041

    摘要： An electronic device includes a first body, a second body, a touch pad module and a speaker module. The first body has an assembling region. The second body is pivoted to the first body. The touch pad module and the speaker module are disposed in the assembling region, wherein the touch pad module includes a first extending circuit board which is configured with a conductive pad. The speaker module is located at one side of the touch pad module. The speaker module includes a speaker and a conductive elastic component, and the conductive elastic component contacts the conductive pad. An assembling method of an electronic device is also provided.