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11.发明申请Adhesive sheet with base for flexible printed wiring boards, production method therefor, multilayer flexible printed wiring board and flex-rigid printed wiring board 审中-公开用于柔性印刷线路板的基底的粘合片，其制造方法，多层柔性印刷线路板和柔性刚性印刷线路板公开(公告)号：US20090314523A1
公开(公告)日：2009-12-24
申请号：US11919139
申请日：2006-04-19
CPC分类号： B32B17/04 , C08G18/095 , C08G18/7614 , C08G18/7671 , C08G59/4042 , C08K5/3445 , C08L63/00 , C08L79/00 , C08L79/08 , C08L2666/20 , C08L2666/22 , C09J7/21 , C09J7/35 , C09J163/00 , C09J179/00 , C09J2400/263 , C09J2463/00 , C09J2479/08 , H05K3/386 , H05K3/4623 , H05K3/4626 , H05K3/4691 , H05K2201/0154 , H05K2201/0195 , Y10T442/2738
摘要： An adhesive sheet with a base for flexible printed wiring boards is provided, which has advantages of easiness of machining, excellent moldability, high rigidity and preventing the fall of resin dust particles during machining of a multilayer flexible printed wiring board or a flex-rigid printed wiring board. This adhesive sheet is used for bonding of a flexible printed wiring board made of a polyimide resin, and comprises a woven or nonwoven fabric as the base and a resin composition. The resin composition contains, as essential components, (a) an epoxy resin having two or more of epoxy groups in one molecule; (b) a polycarbodiimide resin dispersible in a solvent, in which the epoxy resin (a) is also dispersible, and having a number average molecular weight of 2000 or more and less than 10000; and (c) an imidazole curing agent. A weight ratio of the component (a) and the component (b) is in a range of 80:20 to 20:80.
摘要翻译： 提供了一种具有柔性印刷电路板基部的粘合片，其具有加工容易性，成型性优异，刚性高，防止在多层柔性印刷线路板或柔性印刷线路板加工过程中树脂粉尘颗粒的下落 接线板 该粘合片用于粘接由聚酰亚胺树脂制成的柔性印刷线路板，并且包括作为基底的机织或非织造织物和树脂组合物。 树脂组合物含有（a）一分子中具有2个以上的环氧基的环氧树脂作为必要成分， （b）分散在溶剂中的聚碳二亚胺树脂，其中环氧树脂（a）也可分散，数均分子量为2000以上且小于10000; 和（c）咪唑固化剂。 组分（a）和组分（b）的重量比在80:20至20:80的范围内。
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公开(公告)号：US06979703B2
公开(公告)日：2005-12-27
申请号：US10330479
申请日：2002-12-30
申请人： Ikuo Takahashi , Hideshi Tomita
发明人： Ikuo Takahashi , Hideshi Tomita
CPC分类号： C08G18/025 , C08G59/4042 , C08G2350/00 , C08K7/20
摘要： It is an object of the present invention to provide a composition for an acoustically matching layer, having sufficient mechanical strength to allow itself to be easily formed, and capable of giving an acoustically matching layer highly stable in characteristics over extended periods even under high temperature and high humidity conditions. The present invention provides a composition containing a carbodiimide resin for an acoustically matching layer, where the composition may further contain inorganic hollow bodies or inorganic hollow bodies and another reactive resin; a process for producing a formed article of an acoustically matching layer by curing and forming under heating the composition in a mold for the acoustically matching layer; and an ultrasonic transducer using the same composition and ultrasonic transducer using the same formed article.
摘要翻译： 本发明的目的是提供一种用于声匹配层的组合物，其具有足够的机械强度以允许其容易地形成，并且能够在甚至在高温下在长时间内使特性高度稳定的声匹配层，以及 高湿度条件。 本发明提供一种含有用于声匹配层的碳二亚胺树脂的组合物，其中该组合物还可以含有无机中空体或无机中空体和另一反应性树脂; 通过在用于声匹配层的模具中固化和加热所述组合物来形成声匹配层的成形制品的方法; 以及使用相同组成的超声波换能器和使用相同的成形物品的超声换能器。
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公开(公告)号：US20050261448A1
公开(公告)日：2005-11-24
申请号：US11133343
申请日：2005-05-20
申请人： Ikuo Takahashi , Hideshi Tomita
发明人： Ikuo Takahashi , Hideshi Tomita
CPC分类号： C08G18/10 , C08G18/44 , C08G18/4854 , H05K1/0346 , H05K1/0393 , Y10T428/31504 , C08G18/095 , C08G18/025
摘要： A thermosetting polycarbodiimide copolymer of the present invention comprises in a molecule thereof, a soft segment containing at least one residue formed by removing opposite functional end groups of polytetramethylene ether glycol, polyether block amide and polyalkylene carbonate diol having at least two mixed alkylene chains selected from the group consisting of hexamethylene, pentamethylene and tetramethylene; and a hard segment made of polycarbodiimide bonded to the soft segment through at least one bond selected from the group consisting of an urethane bond, a urea bond and an amide bond. The thermosetting polycarbodiimide copolymer can exhibit not only a high heat resistance and a good flexibility, but also an excellent flexing resistance (resistance to 180° bending),and can be, therefore, suitably used in applications of various electronic parts, for example, as materials of base films or cover-lay films for flexible wiring boards, or adhesive films.
摘要翻译： 本发明的热固性聚碳化二亚胺共聚物在其分子中包含含有至少一个残基的软链段，其通过除去具有至少两个混合亚烷基链的聚四亚甲基醚二醇，聚醚嵌段酰胺和聚亚烷基碳酸酯二醇的相对官能端基形成， 由六亚甲基，五亚甲基和四亚甲基组成的组; 以及由通过选自氨基甲酸酯键，脲键和酰胺键的至少一个键与软链段结合的聚碳化二亚胺制成的硬链段。 热固性聚碳化二亚胺共聚物不仅具有高的耐热性和良好的柔软性，而且还具有优异的抗弯曲性（抗弯曲性为180°），因此可以适用于各种电子部件的应用，例如 用于柔性布线板或粘合膜的基膜或覆盖膜的材料。
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14.发明申请公开(公告)号：US20050064200A1
公开(公告)日：2005-03-24
申请号：US10944419
申请日：2004-09-20
申请人： Ikuo Takahashi , Hideshi Tomita
发明人： Ikuo Takahashi , Hideshi Tomita
IPC分类号： B05D7/24 , B32B27/34 , C08G59/32 , C08G59/40 , C08L63/00 , C08L79/00 , C09J7/02 , C09J11/04 , C09J11/06 , C09J163/00 , C09J179/00 , H05K3/38 , B32B27/36 , B32B27/38 , C08G65/00
CPC分类号： C08L79/00 , C08G59/3245 , C08G59/4042 , C08L63/00 , C08L2666/20 , C08L2666/22 , C09J163/00 , C09J179/00 , H05K3/386 , H05K2201/0154 , H05K2201/0355 , Y10T428/31511 , Y10T428/31786
摘要： A binder composition suitable for electronic parts applications and adapted for lamination treatments, which has particularly superior storage stability and adhesive strength as well as a high elastic modulus even at high temperatures, and an adhesive film using the same. More concretely, a binder composition for lamination to be used for such as adhesion of copper foil onto a glass fiber reinforced epoxy resin substrate, characterized by containing a carbodiimide resin (a) and a high molecular weight epoxy resin (b) having average molecular weight of not lower than 500, and the ratio of the components being 30 to 200 parts by weight of (b) based on 100 parts by weight of (a), as well as an adhesive film using the same, and the like.
摘要翻译： 适用于电子部件应用并适用于层压处理的粘合剂组合物，以及使用该粘合剂组合物的粘合剂膜，其具有特别优异的储存稳定性和粘合强度以及甚至在高温下的高弹性模量。 更具体地说，将用于层压的粘合剂组合物用于将铜箔粘合到玻璃纤维增强环氧树脂基材上，其特征在于含有碳二亚胺树脂（a）和具有平均分子量的高分子量环氧树脂（b） 不低于500，并且组分的比例（a）为100重量份的（b）为30〜200重量份，以及使用其的粘合膜等。
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公开(公告)号：US06331226B1
公开(公告)日：2001-12-18
申请号：US09577395
申请日：2000-05-25
IPC分类号： C09J16302
CPC分类号： H01L24/29 , C08J5/128 , C08L63/00 , C08L2666/20 , C09J163/00 , C09J179/08 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/29388 , H01L2224/29393 , H01L2224/8319 , H01L2224/8385 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/05442 , H01L2924/05432 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A method for bonding LCPs mutually or an LCP and another material comprising the step of bonding LCPs mutually or an LCP and another material using an adhesive prepared by adding a polycarbodiimide resin with an epoxy resin composition comprising an epoxy resin and a curing agent, thereby providing excellent adhesion and heat resistance.
摘要翻译： 一种用于将LCP相互连接的LCP和LCP的方法以及包括使用包含环氧树脂和固化剂的环氧树脂组合物加入聚碳化二亚胺树脂制备的粘合剂的LCP与LCP和另一种材料相互粘合的步骤的另一种材料，从而提供 优异的附着力和耐热性。
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公开(公告)号：US06310119B1
公开(公告)日：2001-10-30
申请号：US09400972
申请日：1999-09-22
IPC分类号： C08L6300
CPC分类号： C08J5/18 , C08J2379/00 , C08L79/00 , C08L63/00
摘要： The present invention provides a film-shaped encapsulating agent for electronic parts which is composed essentially of a polycarbodiimide resin and an epoxy resin or of a polycarbodiimide resin, an epoxy resin and colorant, wherein the polycarbodiimide resin has a polystyrene-reduced number-average molecular weight of 3,000 to 50,000 as determined by gel permeation chromatography and the epoxy resin is contained in a proportion of 20 to 150 parts by weight per 100 parts by weight of the polycarbodiimide resin. The film-shaped encapsulating agent enables, for its good processability, the continuous encapsulation of electronic parts without requiring any expensive apparatus (therefore, no cost increase is incurred) and is excellent in heat resistance and electrical insulation after the encapsulation.
摘要翻译： 本发明提供一种基本上由聚碳二亚胺树脂和环氧树脂或聚碳化二亚胺树脂，环氧树脂和着色剂组成的电子部件的膜状包封剂，其中聚碳化二亚胺树脂具有聚苯乙烯换算的数均分子量 通过凝胶渗透色谱法测定的重量为3,000〜50,000，环氧树脂的含量相对于100重量份聚碳二亚胺树脂为20〜150重量份。 由于其良好的加工性，电子部件的连续封装不需要任何昂贵的设备（因此，不会产生成本增加），因此在封装后的耐热性和电绝缘性方面优异。
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公开(公告)号：US5679730A
公开(公告)日：1997-10-21
申请号：US643923
申请日：1996-05-07
申请人： Satoshi Amano , Hideshi Tomita
发明人： Satoshi Amano , Hideshi Tomita
IPC分类号： C09J163/00 , C09J179/00 , C08L63/00 , C08L63/02
CPC分类号： C09J163/00 , C09J179/00
摘要： An epoxy resin composition consisting essentially of an epoxy resin, a thixotropy-imparting agent, a filler used as necessary, water and a polycarbodiimide resin; and an epoxy resin-based adhesive comprising the above epoxy resin composition and a curing agent. The above epoxy resin composition has excellent thixotropy and low stringiness; and the above epoxy resin-based adhesive, when cured, shows neither metal corrosion nor reduction in moisture resistance despite the presence of water in the adhesive, and has excellent heat resistance and adhesivity.
摘要翻译： 主要由环氧树脂，触变性赋予剂，根据需要使用的填充剂，水和聚碳化二亚胺树脂组成的环氧树脂组合物; 以及包含上述环氧树脂组合物和固化剂的环氧树脂基粘合剂。 上述环氧树脂组合物具有优异的触变性和低的拉丝性; 上述环氧树脂类粘合剂固化时，即使在粘合剂中存在水，也不显示金属腐蚀性和耐湿性降低，并且具有优异的耐热性和粘合性。
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公开(公告)号：US5650476A
公开(公告)日：1997-07-22
申请号：US541157
申请日：1995-10-11
IPC分类号： C08G18/02
CPC分类号： C08G18/025 , C08G2140/00
摘要： A process for producing a polycarbodiimide resin powder, which includes reacting an organic diisocyanate in the presence of a carbodiimidization catalyst in a solvent to produce a polycarbodiimide resin and obtaining the resin in a powder form, where the organic diisocyanate is represented by the following formula ##STR1## where R.sub.1 is a lower alkyl group or a lower alkoxyl group, or ##STR2## where R.sub.2 and R.sub.3 are independently a hydrogen atom, a lower alkyl group or a lower alkoxyl group, and X is an oxygen atom or a methylene group, or ##STR3## where R.sub.4 and R.sub.5 are independently a hydrogen atom, a lower alkyl group or a lower alkoxyl group; the solvent is a mixed solvent of a good solvent to polycarbodiimide resin and a poor solvent to the resin, having a precipitation number of 30-80; and when the reaction has reached a certain stage, the reaction system is cooled to make the system a slurry of a polycarbodiimide, and then the polycarbodiimide is obtained in a powder form.
摘要翻译： 一种聚碳化二亚胺树脂粉末的制造方法，其特征在于，在碳二亚胺化催化剂存在下，在溶剂中使有机二异氰酸酯反应，生成聚碳化二亚胺树脂，得到粉末状的树脂，其中有机二异氰酸酯由下式 IMAGE>或
，其中R1是低级烷基或低级烷氧基，或者其中R2和R3独立地是氢原子，低级烷基或低级烷氧基，X是氧原子或 亚甲基或者其中R 4和R 5独立地是氢原子，低级烷基或低级烷氧基; 溶剂是良溶剂与聚碳二亚胺树脂的混合溶剂和对树脂的不良溶剂的混合溶剂，其沉淀数为30-80; 当反应达到一定阶段时，将反应体系冷却，使体系成为聚碳化二亚胺的浆液，得到粉末状的聚碳化二亚胺。 -
公开(公告)号：US06300425B1
公开(公告)日：2001-10-09
申请号：US09286801
申请日：1999-04-06
申请人： Satoshi Amano , Hideshi Tomita
发明人： Satoshi Amano , Hideshi Tomita
IPC分类号： C08L6300
CPC分类号： C08L79/00 , C08G18/025 , C08G59/4042 , C08L63/00 , C09D163/00 , C08L2666/04
摘要： A modified carbodiimide resin obtainable by reacting a carbodiimide resin comprising a repeating unit represented by the general formula: —(NCN—R1)— wherein R1 represents a divalent organic group, with an aromatic diamine represented by the general formula: H2N—R2—NH2 wherein R2 represents a divalent organic group having a benzene ring, and a thermosetting resin composition comprising the modified carbodiimide resin and an epoxy resin.
摘要翻译： 通过使包含由以下通式表示的重复单元的碳二亚胺树脂与其中由通式H2N-R2-NH2表示的芳族二胺反应得到的改性碳化二亚胺树脂： - （NCN-R1） - 其中R 1表示二价有机基团 其中R2表示具有苯环的二价有机基团，和包含改性碳二亚胺树脂和环氧树脂的热固性树脂组合物。
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公开(公告)号：US06225417B1
公开(公告)日：2001-05-01
申请号：US09361303
申请日：1999-07-27
IPC分类号： C08L6302
CPC分类号： C08L63/00 , C08G18/025 , C08G59/4021 , C08L79/02 , C08L2666/20
摘要： The present invention provides a one-pack type epoxy resin composition comprising an epoxy resin having at least two epoxy groups in the molecule and a polyguanidine. The one-pack type epoxy resin composition has high storage stability, can be made into a film, is curable at relatively low temperatures, and has high adhesivity.
摘要翻译： 本发明提供一种单组分型环氧树脂组合物，其包含在分子中具有至少两个环氧基的环氧树脂和多胍。 单组分型环氧树脂组合物具有高储存稳定性，可制成薄膜，可在相对较低的温度下固化，并且具有高粘合性。
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