Accurate Integrated Circuit Performance Prediction Using On-Board Sensors
    11.
    发明申请
    Accurate Integrated Circuit Performance Prediction Using On-Board Sensors 有权
    使用板载传感器的精确集成电路性能预测

    公开(公告)号:US20080120065A1

    公开(公告)日:2008-05-22

    申请号:US11839826

    申请日:2007-08-16

    IPC分类号: G06F19/00 G06F11/30

    CPC分类号: G01R31/2884 G01R31/31727

    摘要: This invention places plural ring oscillators on a semiconductor chip during manufacture. The respective oscillation frequencies of these ring oscillators are measured. The semiconductor chip is assigned a grade dependent upon the measured frequencies. The ring oscillators are disposed proximate to critical paths on the semiconductor chip and employ circuit types to model the critical path operation under as many the manufacturing variations as possible. A linearly fitted model of ring oscillator frequencies to critical path delays is constructed during characterization after manufacture.

    摘要翻译: 本发明在制造过程中将多个环形振荡器放置在半导体芯片上。 测量这些环形振荡器的相应振荡频率。 半导体芯片的分配等级取决于测量的频率。 环形振荡器靠近半导体芯片上的关键路径设置,并且采用电路类型以在尽可能多的制造变化的范围内对关键路径操作进行建模。 在制造后的表征过程中,建立了环形振荡器频率到关键路径延迟的线性拟合模型。