Patent search ap:"Keith Cook" Page 2

11.

发明申请
Methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating memory circuitry, integrated circuitry and memory integrated circuitry 有权

公开(公告)号：US20060046426A1

公开(公告)日：2006-03-02

申请号：US11200286

申请日：2005-08-09

Applicant: Gurtej Sandhu , Robert Patraw , M. Ceredig Roberts , Keith Cook

Inventor： Gurtej Sandhu , Robert Patraw , M. Ceredig Roberts , Keith Cook

IPC: H01L21/76

CPC classification number: H01L21/76229 , H01L27/1052

Abstract: The invention includes methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating integrated circuitry including memory circuitry, and integrated circuitry such as memory integrated circuitry.

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