摘要:
A chip information output circuit including a fuse box, capable of reducing a layout area without affecting input capacitance, is provided. The chip information output circuit includes a plurality of fuse blocks for generating different outputs according to whether a fuse is cut and a pipeline circuit for receiving a plurality of signals, which are output in parallel from the respective fuse blocks, and serially outputting the plurality of signals. Each of the fuse blocks includes a plurality of fuse boxes for generating output signals, the levels of which are either a high or low logic level according to whether the fuses included therein are cut, wherein the respective fuse boxes are enabled in response to the respective control signals and the output lines of the fuse boxes are wired by an OR operation. The pipeline circuit includes a plurality of serially connected latch units for latching signals output from the fuse blocks and outputting the latched signals.
摘要:
Integrated circuit devices and methods of operating same include a delayed locked loop (DLL) circuit that can be operated at a high frequency during a normal operation mode and during a test mode. The test mode may be, for example, for performing burn-in testing. For example, an integrated circuit device may include a DLL control circuit that generates a control signal that is responsive to a test mode signal. An oscillator circuit may generate a clock signal that is responsive to the test mode signal. This clock signal may be a high frequency clock signal, such as that used to drive a DLL circuit during a normal operation mode. A DLL circuit, which is responsive to the clock signal, may be configured to operate in either a test mode or a normal operation mode based on the control signal. By generating the clock signal at a high frequency, the DLL circuit may be evaluated during burn-in testing, for example, under conditions that are comparable to conditions during normal operation.
摘要:
Disclosed is a memory device, comprising a memory controller, a clock input pin for receiving a clock signal, a first chip selection signal input pin for receiving a first chip selection signal for a row address strobe from the memory controller, a second chip selection signal input pin for receiving a second chip selection signal for a column address strobe from the memory controller, a row command input pin for receiving a row command from the memory controller, a column command input pin for receiving a column command from the memory controller, a plurality of row address input pins for receiving row addresses from the memory controller, and a plurality of column address input pins for receiving column addresses from the memory controller.
摘要:
A semiconductor memory device includes input/output circuitry capable of operating in sync with an externally provided I/O clock signal. A data in buffer and a data out buffer provide for serial to parallel conversion of write data and, conversely, parallel to serial conversion of read data. The data buffers can be synchronized with the external I/O clock signal thereby decoupling their operation from the internal system clock signal. This strategy improves I/O bandwidth and further provides for matching different numbers of bit lines or word sizes as between the I/O data port and the memory array itself. An internal I/O clock generator can be provided for generating I/O clock signals, again without the limitation of synchronizing to the internal system clock signal.
摘要:
An integrated circuit memory device includes a test mode. Data is written to and read from the integrated circuit memory device in the test mode. The integrated circuit memory device includes a memory array that includes memory cells that store data. A test control circuit generates control signals that control the data read from the memory cells. A data output circuit outputs data read from the memory cells from the integrated circuit memory device in response to the test column address strobe signal. In particular, the test column address strobe signal includes a series of high to low and low to high transitions, wherein the data output circuit outputs data read from the memory cells in response to the series of high to low and low to high transitions. The high to low and low to high transitions of the test column address strobe signal may be used to output the data read from the memory cells, thereby reducing the need for an external test clock signal to be supplied to the integrated circuit memory device during testing.
摘要:
A semiconductor memory device has a memory cell region and a peripheral region. The device includes low voltage transistors at the peripheral region having gate insulation films with different thicknesses. For example, a gate insulation film of a low voltage transistor used in an input/output circuit of the memory device may be thinner than the gate insulation film of a low voltage transistor used in a core circuit for the memory device. Since low voltage transistors used at an input/output circuit are formed to be different from low voltage transistors used at a core circuit or a high voltage pump circuit, high speed operation and low power consumption characteristics of a non-volatile memory device may be.
摘要:
A semiconductor memory device includes a plurality of memory areas. Each of the memory areas includes a normal cell array and a redundancy cell array for repairing defective cells generated in the normal cell array such that the semiconductor memory device is usable even when memory arrays include defective cells. A size of a redundancy cell array of a first memory area is greater than a size of the redundancy cell arrays of the other memory areas.
摘要:
A memory system comprises a controller that generates a processor clock, and a plurality of memory devices each comprising an internal clock generator that generates an internal clock in synchronization with the processor clock, and a memory that performs a peak current generation operation in synchronization with the internal clock, wherein at least two of the memory devices generate their respective internal clocks at different times such that the corresponding peak current generation operations are performed at different times.
摘要:
A semiconductor memory device has a memory cell region and a peripheral region. The device includes low voltage transistors at the peripheral region having gate insulation films with different thicknesses. For example, a gate insulation film of a low voltage transistor used in an input/output circuit of the memory device may be thinner than the gate insulation film of a low voltage transistor used in a core circuit for the memory device. Since low voltage transistors used at an input/output circuit are formed to be different from low voltage transistors used at a core circuit or a high voltage pump circuit, high speed operation and low power consumption characteristics of a non-volatile memory device may be.
摘要:
An integrated circuit memory device may include a memory cell array and a plurality of data input/output pins. The plurality of data input/output pins may be configured to receive data from a memory controller to be written to the memory cell array during a data write operation, and the data input/output pins may be further configured to provide data to the memory controller from the memory cell array during a data read operation. A mode register may be configured to store information defining an operational characteristic of the memory device, and the mode register may be configured to be set using the data input/output bus. Related methods, systems, and additional devices are also discussed.