公开(公告)号：US20090011262A1

公开(公告)日：2009-01-08

申请号：US11857034

申请日：2007-09-18

申请人： Myong Jae Yoo ,  Woo Sung Lee ,  Seong Dae Park ,  Se Hoon Park

发明人： Myong Jae Yoo ,  Woo Sung Lee ,  Seong Dae Park ,  Se Hoon Park

IPC分类号： B32B27/34 ,  C08K3/04 ,  C08K3/10 ,  C08L39/04

CPC分类号： H05K1/0353 ,  C08F222/40 ,  C08G73/126 ,  C08L79/085 ,  H05K2201/0158 ,  Y10T428/31721

摘要： The present invention relates to a prepreg, a composite film, and a laminated material for circuit used for thermosetting composite resin compositions and printed circuit boards, and particularly to a thermosetting composite resin composition mixed with COP (Cyclo Olefin Polymer) and thermally cross-linkable resin, wherein the COP having excellent electrical characteristics at a high frequency and thermally cross-linkable resin are blended to allow having a less dielectric constant and a less dielectric loss than those of the conventional composite resin composition, and inorganic fillers such as ceramic material, metal material, carbon black are added to allow having dielectric characteristics covering from a low dielectric constant to a high dielectric constant.

摘要翻译： 本发明涉及用于热固性复合树脂组合物和印刷电路板的预浸料，复合膜和电路用层压材料，特别涉及与COP（环烯烃聚合物）和热交联性混合物的热固性复合树脂组合物 树脂，其中在高频率和可热交联的树脂上具有优异电特性的COP被共混以允许具有比常规复合树脂组合物更低的介电常数和更低的介电损耗，以及无机填料如陶瓷材料， 添加金属材料，炭黑以允许具有从低介电常数到高介电常数的介电特性。