Abstract:
An electrically-erasable, electrically-programmable ROM or an EEPROM is constructed using an enhancement transistor merged with a floating-gate transistor, where the floating-gate transistor has a small self-aligned tunnel window positioned on the opposite side of the source from the channel and drain, in a contact-free cell layout, enhancing the ease of manufacture and reducing cell size. In this cell, the bitlines and source/drain regions are buried beneath relatively thick silicon oxide, which allows a favorable ratio of control gate to floating gate capacitance. Programming and erasing are provided by the tunnel window area on the outside of the source (spaced from the channel). The tunnel window has a thinner dielectric than the remainder of the floating gate to allow Fowler-Nordheim tunneling.
Abstract:
One aspect of the invention relates to a method for accessing a memory device. One embodiment relates to a method for accessing a memory device. In the method during a read operation, one data value is provided on a local IO line while complimentary local IO line that is associated with the local IO line is inactivated. During a write operation, another data value is provided on the local IO line and a complimentary data value is provided on the complimentary local IO line. Other systems and methods are also disclosed.
Abstract:
The circuit of this invention improves significantly the programming speed of a Flash EPROM. The circuit includes a detector circuit (DC) using a pre-charge capacitor (C1), capacitor dividers [(C1/(C1+C2) and C3/(C2+C3)] and a voltage comparator (COMP) to signal a control logic circuit (CLC) when the programming voltage is within supply voltage (V.sub.cc) of its final value. At that point the control logic circuit (CLC) boosts the voltage on one terminal of a boost capacitor (BC) by the value of the supply voltage (V.sub.cc). The other terminal (XDD) of the boost capacitor (BC) furnishes the boosted programming voltage for the Flash EPROM.
Abstract:
An array source signal discharge controller device (10) includes a pulse converter circuit (12) that receives an erase pulse signal (ERPULSE). The pulse converter circuit (12) converts the erase pulse signal (ERPULSE) into a pulse control signal (ERPCL) that is subsequently translated into a higher voltage level bias signal (ECL.sub.--). The higher voltage level bias signal (ECL.sub.--) drives array source signal generator circuits (16) that produce array source signals (AS) to erase particular array subsections of memory as determined by a selection circuit (17). The array source signal generator circuits (16) also generate array source command signals (ASCOM.sub.--) to indicate a discharging status of all array source signals (AS). An erase completion detector circuit (18) monitors the array source command signals (ASCOM.sub.--) and generates an array source detect signal (ASDET) to indicate completion of array source signal (AS) discharging. The pulse converter circuit (12) receives the array source detect signal (ASDET) and generates an erase completion signal (ERCTR) and a pulldown control signal ERCTR.sub.-- to control final discharge of the array source signals (AS) and indicate that normal memory access may resume. The pulse converter circuit (12) also generates a pulldown signal (ERD.sub.--) that controls discharge of the array source signals (AS) by preventing current surges from appearing on the array source signals (AS) during discharge.
Abstract:
The power-on reset circuit of this invention includes a current-sensing circuit, a pulse-stretching circuit, and a voltage-reference circuit. The voltage-reference circuit consists, for example, of one N-Channel and one P-Channel MOS transistor. The circuit of this invention uses a static voltage reference comprised of CMOS transistors to detect the power-up condition. The circuit of this invention improves detection of a transient power-supply voltage Vcc loss and detects that power-supply voltage transient on both rising and falling edges.
Abstract:
The column-line short detection circuit of this invention includes a special test circuit that turns off wordlines (15), a N-channel transistor (23) for each column line (18), a decoder (19a) that uses only the least significant column address (20d) for input to the test circuit, and a sensor (SA) to detect current between shorted column lines (18). Because the column-line short detection circuit of this invention uses only the least significant address as input for column decoder (19a), it requires a very small number of transistors.
Abstract:
A method is described for programming a semiconductor array of EEPROM cells. A selected cell is connected, by definition, to a selected source-column line, a selected drain-column line and a selected wordline. Each deselected memory cell in the array is connected to a deselected source-column line, a deselected drain-column line and/or a deselected wordline. The method includes preselecting first, second, third, fourth and fifth programming voltages such that the second programming voltage is more positive than the first programming voltage and such that the third, fourth and fifth programming voltages are intermediate between the first and second programming voltages. The first programming voltage is applied at least to a selected column line and to each of the same-type deselected column lines. The third programming voltage is applied to the selected wordline and the fourth programming voltage is applied to each deselected wordline. After a pre-charge time interval, the fifth programming voltage is applied to each same-type deselected column line and, after an optional additional pre-charge time interval, the second programming voltage is applied to the selected wordline. After a program time interval, the third programming voltage is applied to the selected wordline and, after an optional discharge time interval, the first programming voltage is applied to each same-type deselected column line. Each deselected wordline is maintained at the fourth programming voltage for an additional discharge time interval. The third, fourth and fifth programming voltages may have the same value.
Abstract:
A pair of electrically erasable, electrically programmable memory cells are formed at a face of a semiconductor layer (10) and include respective source regions (30a, 30b), a shared drain region (28) and respective channel regions (38a, 38b). Each cell has a floating gate conductor (46a, 46b) that controls the conductance of a respective subchannel region (74a, 74b) and may be programmed through Fowler-Nordheim electron tunneling through a respective tunnel oxide window (40a, 40b) from a respective source region (30a, 30b). A field plate conductor (40a) controls the conductance of respective subchannel regions (70a, 70b) within each channel region (38a, 38b). A word line or control gate conductor (62) is insulatively disposed adjacent respective third, remaining channel subregions (53a, 53b) and further is disposed insulatively adjacent the floating gates (46a, 46b) to program or erase them.
Abstract:
An electrically-erasable, programmable ROM cell, or an EEPROM cell, is constructed using an enhancement transistor merged with a floating-gate transistor, where the floating-gate transistor has a small tunnel window, in a contact-free cell layout, enhancing the ease of manufacture and reducing cell size. The bitlines and source/drain regions are buried beneath relatively thick silicon oxide, which allows a favorable ratio of control gate to floating gate capacitance. Programming and erasing are provided by the tunnel window are near or above the channel side of the source. The window has a thinner dielectric than the remainder of the floating gate, to allow Fowler-Nordheim tunneling. By using dedicated drain or ground lines, rather than a virtual-ground layout, and by using thick oxide for isolation between bitlines, the floating gate can extend onto adjacent bitlines and isolation area, resulting in a favorable coupling ratio. Isolation between wordlines is also by thick thermal oxide in a preferred embodiment, further improving the coupling ratio. Bitline and wordline spacing may be selected for optimum pitch or aspect ratio. Bitline to substrate capacitance is minimized.
Abstract:
One embodiment of the invention includes a memory system. The system comprises a memory cell coupled to a bit-line node. The memory cell can be configured to generate a bit-line current on the bit-line node in response to a bias voltage during a read operation. The system further comprises a sense amplifier configured to maintain a substantially constant voltage magnitude of the bit-line node during a pre-charge phase and a sense phase of the read operation based on regulating current flow to and from the bit-line node, and to determine a memory value of the flash memory transistor during the read operation based on a magnitude of the bit-line current on the bit-line node.