公开(公告)号：US20120080784A1

公开(公告)日：2012-04-05

申请号：US12897933

申请日：2010-10-05

Applicant: SURESH D. KADAKIA ,  Kamal K. Sikka ,  Hilton T. Toy ,  Jeffrey A. Zitz

Inventor： SURESH D. KADAKIA ,  Kamal K. Sikka ,  Hilton T. Toy ,  Jeffrey A. Zitz

IPC: H01L23/04 ,  H01L21/50

CPC classification number: H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/433 ,  H01L23/4338 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.