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公开(公告)号:US20220141997A1
公开(公告)日:2022-05-05
申请号:US17437610
申请日:2020-03-10
Applicant: APR Technologies AB
Inventor: Are Björneklett , Peter Nilsson , Robert Thorslund
Abstract: An arrangement for thermal management is disclosed, wherein a heat generating component is arranged within an enclosure, defined by an enclosure wall and in thermal contact with a thermal management fluid. The arrangement comprises an electrohydrodynamic flow unit, comprising a first and a second electrode, for controlling the flow of fluid within the enclosure.