Metrology Apparatus, Method of Measuring a Structure, Device Manufacturing Method

    公开(公告)号:US20190129315A1

    公开(公告)日:2019-05-02

    申请号:US16169514

    申请日:2018-10-24

    Abstract: Metrology apparatus and methods are disclosed for measuring a structure formed on a substrate. In one arrangement, different components of a radiation beam are selectively extracted after reflection from the structure and independently detected. For each component, radiation is selected from one of a plurality of predetermined regions in a downstream pupil plane of the optical system downstream from the structure. Radiation is further selected from one of two predetermined orthogonal polarization states. The predetermined orthogonal polarization states are oriented differently as a pair for each of at least a subset of components comprising radiation selected from different predetermined regions in the downstream pupil plane.

Patent Agency Ranking