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50 条记录 (耗时 0.024 秒)

    Retaining ring with conductive portion
    11.
    发明授权
    Retaining ring with conductive portion 失效
    带导电部分的保持环

    公开(公告)号：US07276743B2

    公开(公告)日：2007-10-02

    申请号：US11127790

    申请日：2005-05-11

    申请人： Antoine P. Manens ,  Suresh Shrauti ,  Alain Duboust ,  Yan Wang ,  Liang-Yuh Chen

    发明人： Antoine P. Manens ,  Suresh Shrauti ,  Alain Duboust ,  Yan Wang ,  Liang-Yuh Chen

    IPC分类号： H01L29/74 ,  H01L31/111

    CPC分类号： B23H5/08 ,  B24B37/32

    摘要： A retaining ring for use with electrochemical mechanical processing is described. The retaining ring has a generally annular body formed with a conductive portion and a non-conductive portion. The non-conductive portion contacts the substrate during polishing. The conductive portion is electrically biased during polishing to reduce the edge effect that tends to occur with conventional electrochemical mechanical processing systems.

    摘要翻译： 描述了一种用于电化学机械加工的保持环。 保持环具有形成有导电部分和非导电部分的大致环形体。 非导电部分在抛光期间接触基板。 导电部分在抛光期间被电偏置以减少常规电化学机械处理系统倾向于发生的边缘效应。

    Process control in electrochemically assisted planarization
    15.
    发明授权
    Process control in electrochemically assisted planarization 失效
    电化学辅助平面化过程控制

    公开(公告)号：US07294038B2

    公开(公告)日：2007-11-13

    申请号：US11425339

    申请日：2006-06-20

    申请人： Antoine P. Manens ,  Liang-Yuh Chen

    发明人： Antoine P. Manens ,  Liang-Yuh Chen

    IPC分类号： B23H3/00 ,  B24D11/02 ,  C23H3/00 ,  C25D17/00

    CPC分类号： B24B37/046 ,  B23H5/06 ,  B23H5/08 ,  B24B37/042 ,  B24B37/22 ,  B24B49/16

    摘要： In one embodiment, a pad assembly for electro-processing a substrate is provided which includes a first conductive layer having a working surface adapted to contact the substrate during a polishing process, an intermediate layer coupled to the first conductive layer, and a second conductive layer coupled to the intermediate layer. The second conductive layer may have a plurality of independently electrically biasable zones and is configured to be coupled with a power delivery arrangement. The intermediate layer may contain a polymer material support disk, a backing layer, or combinations thereof. Generally, the first conductive layer, the second conductive layer, and the intermediate layer are adhered or secured together and removable as a unitary replaceable body. In one example, the intermediate layer may contain a plurality of perforations or cannels that have a diameter within a range from about 0.5 mm to about 10 mm.

    摘要翻译： 在一个实施例中，提供了一种用于电处理衬底的焊盘组件，其包括第一导电层，其具有适于在抛光工艺期间接触衬底的工作表面，耦合到第一导电层的中间层和第二导电层 耦合到中间层。 第二导电层可以具有多个独立的电可偏置区域，并且被配置为与电力输送装置耦合。 中间层可以包含聚合物材料支撑盘，背衬层或其组合。 通常，第一导电层，第二导电层和中间层被粘合或固定在一起并作为整体可更换体移动。 在一个示例中，中间层可以包含多个穿孔或孔，其直径在约0.5mm至约10mm的范围内。

    EDGE BEAD REMOVAL PROCESS WITH ECMP TECHNOLOGY
    17.
    发明申请
    EDGE BEAD REMOVAL PROCESS WITH ECMP TECHNOLOGY 审中-公开
    带ECMP技术的边缘除鳞工艺

    公开(公告)号：US20090061617A1

    公开(公告)日：2009-03-05

    申请号：US11849714

    申请日：2007-09-04

    申请人： Alain Duboust ,  Jose Salas-Vernis ,  Antoine P. Manens

    发明人： Alain Duboust ,  Jose Salas-Vernis ,  Antoine P. Manens

    IPC分类号： H01L21/3063

    CPC分类号： H01L21/3063 ,  H01L21/02087

    摘要： A method and apparatus for the removal of a deposited conductive layer along an edge of a substrate using a power ring configured to electro polish an edge of the substrate are provided. The electro polishing of the substrate edge may occur simultaneously with the electrochemical mechanical processing of a substrate face. In certain embodiments a method of electrochemically polishing a substrate having a conductive material disposed thereon is provided. A substrate is coupled with a carrier head comprising a power ring which surrounds an edge of the substrate, wherein the edge of the substrate includes the conductive material. A polishing pad is contacted with a face of the substrate. A first voltage is applied to the power ring to remove conductive material from the edge of the substrate. A second voltage different from the first voltage is applied to the polishing pad to remove a portion of the conductive material from the face of the substrate.

    摘要翻译： 提供了一种用于使用构造为电抛光衬底的边缘的功率环沿着衬底的边缘去除沉积的导电层的方法和装置。 衬底边缘的电抛光可以与衬底面的电化学机械加工同时发生。 在某些实施例中，提供了一种电化学抛光其上布置有导电材料的基板的方法。 衬底与包括围绕衬底的边缘的功率环的载体头耦合，其中衬底的边缘包括导电材料。 抛光垫与基板的表面接触。 向功率环施加第一电压以从衬底的边缘去除导电材料。 将不同于第一电压的第二电压施加到抛光垫，以从衬底的表面去除一部分导电材料。

    PAD ASSEMBLIES FOR ELECTROCHEMICALLY ASSISTED PLANARIZATION
    18.
    发明申请
    PAD ASSEMBLIES FOR ELECTROCHEMICALLY ASSISTED PLANARIZATION 审中-公开
    用于电化学辅助平面化的PAD组件

    公开(公告)号：US20080254713A1

    公开(公告)日：2008-10-16

    申请号：US11870975

    申请日：2007-10-11

    申请人： Antoine P. Manens ,  Liang-Yuh Chen

    发明人： Antoine P. Manens ,  Liang-Yuh Chen

    IPC分类号： B23H3/00 ,  B24B1/00

    CPC分类号： B24B37/046 ,  B23H5/06 ,  B23H5/08 ,  B24B37/042 ,  B24B37/22 ,  B24B49/16

    摘要： In one embodiment, a pad assembly for electro-processing a substrate is provided which includes a first conductive layer having a working surface to contact the substrate during a polishing process, an intermediate layer coupled to the first conductive layer, wherein the intermediate layer contains a plurality of perforations, channels, or combinations thereof, which have diameters within a range from about 0.5 mm to about 10 mm, and a second conductive layer coupled to the intermediate layer, wherein the second conductive layer has a plurality of independently electrically biasable zones and is configured to be coupled with a power delivery arrangement. The intermediate layer may contain a polymer material support disk, a backing layer, or combinations thereof. Generally, the first conductive layer, the second conductive layer, and the intermediate layer are adhered or secured together and removable as a unitary replaceable body.

    摘要翻译： 在一个实施例中，提供了一种用于电处理衬底的焊盘组件，其包括在抛光过程期间具有与衬底接触的工作表面的第一导电层，耦合到第一导电层的中间层，其中中间层包含 其直径在约0.5mm至约10mm范围内的多个穿孔，通道或其组合，以及耦合到中间层的第二导电层，其中第二导电层具有多个独立的可电偏压区域， 被配置为与电力传送装置耦合。 中间层可以包含聚合物材料支撑盘，背衬层或其组合。 通常，第一导电层，第二导电层和中间层被粘合或固定在一起并作为整体可更换体移动。

    Multi-layer polishing pad for low-pressure polishing
    19.
    发明授权
    Multi-layer polishing pad for low-pressure polishing 有权
    用于低压抛光的多层抛光垫

    公开(公告)号：US08066552B2

    公开(公告)日：2011-11-29

    申请号：US11043361

    申请日：2005-01-26

    申请人： Alain Duboust ,  Shou-Sung Chang ,  Wei Lu ,  Siew Neo ,  Yan Wang ,  Antoine P. Manens ,  Yongsik Moon

    发明人： Alain Duboust ,  Shou-Sung Chang ,  Wei Lu ,  Siew Neo ,  Yan Wang ,  Antoine P. Manens ,  Yongsik Moon

    IPC分类号： B24B29/00

    CPC分类号： B24B37/013 ,  B24B37/046 ,  B24B37/205 ,  B24B37/22 ,  B24B37/26 ,  B24D11/02

    摘要： A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing surface, a first thickness, a first compressibility, and a hardness between about 40 to 80 Shore D. The backing layer has a second thickness and has a second compressibility greater than the first compressibility. The first thickness, first compressibility, second thickness and second compressibility are such that the polishing surface deflects more than the thickness non-uniformity of the polishing layer under an applied pressure of 1.5 psi or less.

    摘要翻译： 抛光垫具有固定到抛光层的抛光层和背衬层。 抛光层具有抛光表面，第一厚度，第一可压缩性和约40至80肖氏D之间的硬度。背衬层具有大于第一可压缩性的第二厚度并具有第二可压缩性。 第一厚度，第一可压缩性，第二厚度和第二可压缩性使得抛光表面在1.5psi或更小的施加压力下偏转大于抛光层的厚度不均匀性。