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公开(公告)号：US20190090343A1
公开(公告)日：2019-03-21
申请号：US15711707
申请日：2017-09-21
Applicant: Amazon Technologies, Inc.
Inventor： William Mische
Abstract: Printed circuit boards (PCBs) may include a heat sink configured to draw heat from a surface-mounted component through the PCB toward a side of the PCB opposite a side having the surface-mounted component. The heat sinks may be single piece components that extend at least partially through the PCB. In some embodiments, the PCB may include connectors that interface between the PCB and a heat sink, or possibly other components.
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