公开(公告)号：US20140147737A1

公开(公告)日：2014-05-29

申请号：US14041921

申请日：2013-09-30

Applicant: Apple Inc.

Inventor： George V. Anastas ,  Gregory A. Springer ,  Jack B. Rector, III ,  Joshua R. Funamura ,  Kenneth M. Silz

IPC: H01M2/02 ,  H01M10/04

CPC classification number: H01M2/0287 ,  H01M2/0202 ,  H01M2/0217 ,  H01M2/0265 ,  H01M2/0275 ,  H01M10/04 ,  Y10T29/49108 ,  Y10T29/4911

Abstract: In a first embodiment, a pre-formed pouch is provided that includes a plurality of walls joined in order to define an aperture. An assembly may be inserted into the aperture, which may then be sealed. Further, the pre-formed pouch may be fitted to the shape or dimensions of the assembly that will be inserted. In a second embodiment, an assembly may be covered in a plurality of layers of material, such as first layer of plastic, a layer of metal, and then a second layer of plastic. Each of the coverings may be formed by dipping the assembly in plastic or metal (or other material), molding layers around the assembly, coating the assembly in the layers, vapor depositing plastic or metal (or other material) onto the assembly, and/or a combination of these operations.

Abstract translation: 在第一实施例中，提供了预先形成的小袋，其包括连接以限定孔的多个壁。 组件可以插入孔中，然后可以密封。 此外，预成形袋可以装配到将被插入的组件的形状或尺寸上。 在第二实施例中，组件可以被覆盖在多层材料中，例如第一塑料层，金属层，然后是第二塑料层。 每个覆盖物可以通过将组件浸入塑料或金属（或其它材料），围绕组件的成型层，在层中涂覆组件，将塑料或金属（或其他材料）蒸镀到组件上和/ 或这些操作的组合。

公开(公告)号：US08696388B2

公开(公告)日：2014-04-15

申请号：US13867130

申请日：2013-04-22

Applicant: Apple, Inc.

Inventor： Zheng Gao ,  George Tziviskos ,  Min Chul Kim ,  Vincent Duperron ,  George V. Anastas ,  Gregory A. Springer

IPC: H01R13/648

CPC classification number: H01R12/72 ,  H01R12/721 ,  H01R13/6594 ,  H01R13/6597

Abstract: Electrical connections that provide a highly manufacturable, well-shielded path from a cable to a printed circuit board. One example provides a path that includes a card and a connector. Conductors in a cable may be attached to a card. The card may be shielded with a ground plane on one or more sides and edges. The card may insert into a connector that may be attached to a printed circuit board. The connector may include a shield that may have a top portion that forms electrical contact with a ground plane on a top of a card inserted in the connector. The connector may have an opening for accepting the card that is defined by the top portion of the shield and a plurality of rows of contacts. The rows of contacts may include an outer row of ground contacts, and an inner row of signal contacts.

Abstract translation: 电气连接，提供从电缆到印刷电路板的高度可制造，良好屏蔽的路径。 一个例子提供包括卡和连接器的路径。 电缆中的导体可以附着在卡上。 该卡可以在一个或多个侧面和边缘上用接地平面屏蔽。 卡可以插入到可以附接到印刷电路板的连接器中。 连接器可以包括可以具有与插入在连接器中的卡的顶部上的接地平面形成电接触的顶部的屏蔽件。 连接器可以具有用于接纳由屏蔽件的顶部限定的卡和多个触点列的开口。 触点列可以包括外排的接地触点和内排的信号触点。

公开(公告)号：US20130231008A1

公开(公告)日：2013-09-05

申请号：US13867130

申请日：2013-04-22

Applicant: APPLE INC.

Inventor： Zheng Gao ,  George Tziviskos ,  Min Chul Kim ,  Vincent D. Duperron ,  George V. Anastas ,  Gregory A. Springer

IPC: H01R12/72

CPC classification number: H01R12/72 ,  H01R12/721 ,  H01R13/6594 ,  H01R13/6597

Abstract: Electrical connections that provide a highly manufacturable, well-shielded path from a cable to a printed circuit board. One example provides a path that includes a card and a connector. Conductors in a cable may be attached to a card. The card may be shielded with a ground plane on one or more sides and edges. The card may insert into a connector that may be attached to a printed circuit board. The connector may include a shield that may have a top portion that forms electrical contact with a ground plane on a top of a card inserted in the connector. The connector may have an opening for accepting the card that is defined by the top portion of the shield and a plurality of rows of contacts. The rows of contacts may include an outer row of ground contacts, and an inner row of signal contacts.

Abstract translation: 电气连接，提供从电缆到印刷电路板的高度可制造，良好屏蔽的路径。 一个例子提供包括卡和连接器的路径。 电缆中的导体可以附着在卡上。 该卡可以在一个或多个侧面和边缘上用接地平面屏蔽。 卡可以插入到可以附接到印刷电路板的连接器中。 连接器可以包括可以具有与插入在连接器中的卡的顶部上的接地平面形成电接触的顶部的屏蔽件。 连接器可以具有用于接纳由屏蔽件的顶部限定的卡和多个触点列的开口。 触点列可以包括外排的接地触点和内排的信号触点。