公开(公告)号：US11658404B2

公开(公告)日：2023-05-23

申请号：US17028871

申请日：2020-09-22

Applicant: Apple Inc.

Inventor： Lucas R. Compton

IPC: H01Q1/38 ,  H01Q1/24 ,  H01Q9/42 ,  H01Q9/04

CPC classification number: H01Q1/38 ,  H01Q1/243 ,  H01Q9/0485 ,  H01Q9/42

Abstract: An electronic device may be provided with a conductive sidewall and a phased antenna array having a dielectric resonator antenna aligned with an aperture in the conductive sidewall. A feed probe may excite the antenna to radiate through the aperture at a frequency greater than 10 GHz. The antenna may include an injection-molded plastic substrate that affixes the antenna to the peripheral conductive housing structures, thereby integrating the antenna into the conductive sidewall. A hole or other machining operation may be used to expose the feed probe through the injection-molded plastic substrate. Conductive interconnect structures may be inserted into the substrate and coupled to the feed probe. The interconnect structures may be soldered to a circuit board. The circuit board may be coupled to the feed probe through the interconnect structures. The circuit board may be mounted to a rear surface or a side surface of the injection-molded plastic substrate.

公开(公告)号：US20220336965A1

公开(公告)日：2022-10-20

申请号：US17235240

申请日：2021-04-20

Applicant: Apple Inc.

Inventor： Lucas R. Compton

IPC: H01Q21/22 ,  H01Q5/50 ,  H01Q3/34 ,  H01Q1/42 ,  H01Q1/24

Abstract: An electronic device may have a first phased antenna array that radiates through a display and a second phased antenna array that radiates through a rear wall. The first array may include a front-facing dielectric resonator antenna and the second array may include a rear-facing dielectric resonator antenna. The front and rear-facing antennas may share a dielectric resonating element. Feed probe(s) may excite a first volume of the dielectric resonating element to radiate through the display and may excite a second volume of the dielectric resonating element to radiate through the rear wall. The dielectric resonating element may have a geometry that helps to isolate the front-facing dielectric resonator antenna from the rear-facing dielectric resonator antenna. The first and second arrays may collectively cover an entire sphere around the device while occupying a minimal amount of volume within the device.

公开(公告)号：US20220094046A1

公开(公告)日：2022-03-24

申请号：US17028871

申请日：2020-09-22

Applicant: Apple Inc.

Inventor： Lucas R. Compton

IPC: H01Q1/38 ,  H01Q9/04 ,  H01Q9/42 ,  H01Q1/24

Abstract: An electronic device may be provided with a conductive sidewall and a phased antenna array having a dielectric resonator antenna aligned with an aperture in the conductive sidewall. A feed probe may excite the antenna to radiate through the aperture at a frequency greater than 10 GHz. The antenna may include an injection-molded plastic substrate that affixes the antenna to the peripheral conductive housing structures, thereby integrating the antenna into the conductive sidewall. A hole or other machining operation may be used to expose the feed probe through the injection-molded plastic substrate. Conductive interconnect structures may be inserted into the substrate and coupled to the feed probe. The interconnect structures may be soldered to a circuit board. The circuit board may be coupled to the feed probe through the interconnect structures. The circuit board may be mounted to a rear surface or a side surface of the injection-molded plastic substrate.

公开(公告)号：US10908654B2

公开(公告)日：2021-02-02

申请号：US16134738

申请日：2018-09-18

Applicant: Apple Inc.

Inventor： Carli E. Oster ,  Chi Zhang ,  Haowei Wang ,  Lucas R. Compton

IPC: G06F1/16 ,  G06F1/18

Abstract: An electronic device may be provided with a display and conductive sidewalls. The display may include conductive display structures and a cover layer. The cover layer may be mounted to the sidewalls. The sidewalls may define antenna apertures for antennas in the device. Grounding structures may be coupled between the conductive display structures and the sidewalls at locations that at least partially overlap the antenna apertures. The grounding structures may include conductive tape having an adhesive surface. The conductive tape may have a first end at which the adhesive surface is coupled to the conductive display structures. The conductive tape may have a second end that is folded around a layer of heat-activated film and that is coupled to both the display cover layer and the conductive sidewalls. Conductive tape overlapping each antenna aperture may be concurrently assembled into the electronic device as the display is mounted to the sidewalls.