公开(公告)号：US20180374736A1

公开(公告)日：2018-12-27

申请号：US16008569

申请日：2018-06-14

Applicant: Applied Materials, Inc.

Inventor： Niranjan KUMAR ,  Kim Ramkumar VELLORE ,  Douglas H. BURNS ,  Gautam PISHARODY ,  Seshadri RAMASWAMI ,  Douglas A. BUCHBERGER, JR.

IPC: H01L21/683 ,  H01L21/02 ,  H01L21/67

Abstract: Embodiments of the disclosure relate to the use of an electrostatic carrier for securing, transporting and assembling dies on a substrate. In one embodiment, an electrostatic carrier includes a body having a top surface and a bottom surface, at least a first bipolar chucking electrode disposed within the body, at least two contact pads disposed on the bottom surface of the body and connected to the first bipolar chucking electrode, and a floating electrode disposed between the first bipolar chucking electrode and the bottom surface. In another embodiment, a die-assembling system includes the electrostatic carrier configured to electrostatically secure a plurality of dies, a carrier-holding platform configured to hold the electrostatic carrier, a die input platform and a loading robot having a range of motion configured to pick the plurality of dies from the die input platform and place them on the electrostatic carrier.