公开(公告)号：US11860308B1

公开(公告)日：2024-01-02

申请号：US18056171

申请日：2022-11-16

Applicant: Aurora Operations, Inc.

Inventor： Colin Delaney ,  James Ferrara ,  Stefan Heinemann ,  Amir Hosseini ,  Pruthvi Jujjavarapu ,  Yongxuan Liang ,  Parth Panchal ,  Zhizhong Tang

IPC: G01S7/481 ,  G01S17/931 ,  H05K7/20

CPC classification number: G01S7/4814 ,  G01S7/4816 ,  G01S7/4817 ,  G01S17/931 ,  H05K7/20509

Abstract: An integrated chip packaging for a LIDAR sensor mounted to a vehicle includes a laser assembly configured to output a beam, an optical amplifier array chip configured to amplify a beam, and a transceiver chip coupled to the laser assembly and the optical amplifier array chip. The transceiver chip may be configured to emit the beam with reference to a first surface of the transceiver chip through an optical window and receive a reflected beam from a target through the optical window. The integrated chip packaging for the LIDAR sensor defines the configuration of optical components for providing a path for the optical signal to travel in and out of the LIDAR sensor and dissipating the heat generated by the optical components for improved performance.