公开(公告)号：US20190027545A1

公开(公告)日：2019-01-24

申请号：US16023400

申请日：2018-06-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Wenqu LIU ,  Liwen DONG ,  Feng ZHANG ,  Zhijun LV ,  Ning DANG ,  Shizheng ZHANG

IPC: H01L27/32 ,  H01L51/00 ,  H01L51/52 ,  H01L51/56

Abstract: The present invention provides a method for manufacturing an array substrate, including; a step of providing a substrate; a step of making an electrode layer on the substrate; and a step of making a spacer layer and a spacer column on the electrode layer; wherein the spacer column is made by heat-treatment while the spacer layer is being formed, and a method for manufacturing an array substrate. The method for manufacturing an array substrate provided by the present invention can not only shorten the production cycle, lower the production cost, but also avoid the threshold voltage drift of the TFT due to the irradiation of a large area of ultraviolet rays.