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公开(公告)号：US20200233245A1
公开(公告)日：2020-07-23
申请号：US15760401
申请日：2017-09-14
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Hong LI , Pao Ming TSAI
IPC: G02F1/1333 , G09F9/30
Abstract: The present disclosure discloses a flexible module and a method for fabricating the same. The method comprises: attaching a bottom film to a back surface of a flexible panel with an adhesive layer; at least removing the bottom film on the back surface of a bending area of the flexible panel; and bending the flexible panel so that the bending area of the flexible panel bends to complete the fabrication of the flexible module.
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