公开(公告)号：US20190326557A1

公开(公告)日：2019-10-24

申请号：US16502995

申请日：2019-07-03

Applicant: CORNING INCORPORATED

Inventor： Kuan-Ting Kuo ,  Jen-Chieh Lin ,  Lu Zhang

IPC: H01L51/52 ,  H01L51/56 ,  H01L51/00

Abstract: A process includes providing a base substrate and disposing a precursor on the base substrate. The precursor includes powdered particles of a first material and an organic binder. The process includes photo-thermally treating the precursor to form a light extraction layer. The photo-thermal treatment includes exposing the precursor to a flash lamp that is energized in pulses. The process further includes disposing an organic light emitting diode adjacent to the light extraction layer.

公开(公告)号：US10367169B2

公开(公告)日：2019-07-30

申请号：US15784676

申请日：2017-10-16

Applicant: CORNING INCORPORATED

Inventor： Kuan-Ting Kuo ,  Jen-Chieh Lin ,  Lu Zhang

IPC: H01L51/52 ,  H01L51/00 ,  H01L51/56 ,  B05D3/06

Abstract: A process includes providing a base substrate and disposing a precursor on the base substrate. The precursor includes powdered particles of a first material and an organic binder. The process includes photo-thermally treating the precursor to form a light extraction layer. The photo-thermal treatment includes exposing the precursor to a flash lamp that is energized in pulses. The process further includes disposing an organic light emitting diode adjacent to the light extraction layer.