Abstract:
An integrated optical circuit including an operational submicronic waveguide associated with an operational grating intended for the coupling with an optical fiber, further including an alignment grating, identical to the operational grating, associated with a blind waveguide and arranged at a known distance from the operational grating.
Abstract:
An optical system with an optical beam propagation extension, having an input and an output for the optical beam. The system includes at least two optical reflection elements for reflection of the beam, arranged to extend the propagation of the beam by reflection on the reflection elements, and at least one optical beam transmission element arranged to be traversed at least twice by the optical beam in different directions during propagation of the optical beam in the optical system. The optical transmission element ensures an optical transformation of the optical beam each time the optical beam passes through so as to correct the divergence thereof.
Abstract:
The invention relates to a device for coupling an optical fiber and a nanophotonic component formed on a first substrate, wherein the device comprises: an intermediate component formed on a second substrate including a first wave guide adapted for receiving light from the optical fiber and for transmitting the same to a first diffraction grating independently from the polarization of the incident light; second and third diffraction gratings formed on the first substrate and coupled to the nanophotonic component, the first diffraction grating being adapted to provide the first and second light beams respectively towards the second diffraction grating and the third diffraction grating, the first and second beams having perpendicular polarizations.
Abstract:
A non-destructive method for characterizing a surface-illuminated integrated optical coupler associated with an optical waveguide, comprising the steps of measuring the reflection coefficient on a first region of the coupler at a distance from the optical waveguide and constructing a first curve, determining a first model of the reflection coefficient on the first region, performing a first parameter fitting between the first curve and the first model to determine first parameters, measuring the reflection coefficient on a second region of the coupler close to the guide, and constructing a second curve, determining a second model of the reflection coefficient on the second region, performing a second parameter fitting between the second curve and the second model to determine second parameters, and constructing the characteristic of the coupling efficiency of the coupler using the first and second parameters.
Abstract:
The method of coating the area of hybridization of a component that is constituted by two elements bonded to one another by means of a soldering material, including depositing proximate to the component a coating substance capable of filling by capillarity action the volume defined between the hybridized elements of the component. Further, along the periphery of the hybridization area on the lower element of the component is an area of non-wettability in regards to the coating substance, that is defined by depositing an anti-wetting covering of PECVD in regards to the coating substance, whereby the anti-wetting covering on the first element encompasses the hybridization area and surrounds a wetting surface for the coating substance.
Abstract:
Said device comprises a substrate (44) and, on said substrate, an integrated photonic circuit (46) adapted to be coupled to at least one optical waveguide (48) which transmits a light signal (50) and for processing said signal. According to the invention, the circuit comprises two superimposed elementary integrated photonic circuits (52, 54), each of which is adapted to be coupled to a given polarisation state of the signal and to process this state. The invention applies particularly to optical telecommunications.
Abstract:
The light-emitting device includes a base substrate and preferably three light-emitting diodes respectively associated with three primary colors and emitting a part of their signal in the direction of the base substrate. The device includes three chromatic photodetectors formed in the base substrate constituting a semiconducting substrate, and each arranged under an associated light-emitting diode. Each chromatic photodetector includes superposed first, second and third layers. The first layer and third layer have a first type of conductivity and the second layer has a second type of conductivity. The device includes a control component connected to the chromatic photodetectors and to the light-emitting diodes to control the global color of the light emitted by the device.
Abstract:
This assembly of an object and a support is achieved by using solder bumps. At least two wettability areas are made respectively on an object and on a support. Each solder bump ensures electrical contact and mechanical fixing firstly to one of the wettability areas of object and secondly to one of the wettability areas of support. The melting temperature of solder bumps is lower than the melting temperature of each of the wettability areas. Each wettability area of the object forms an angle of 70° to 110° with respect to each wettability area of the support and the object and the support are mutually distant from one another.
Abstract:
A non-destructive method for characterizing a surface-illuminated integrated optical coupler associated with an optical waveguide, comprising the steps of measuring the reflection coefficient on a first region of the coupler at a distance from the optical waveguide and constructing a first curve, determining a first model of the reflection coefficient on the first region, performing a first parameter fitting between the first curve and the first model to determine first parameters, measuring the reflection coefficient on a second region of the coupler close to the guide, and constructing a second curve, determining a second model of the reflection coefficient on the second region, performing a second parameter fitting between the second curve and the second model to determine second parameters, and constructing the characteristic of the coupling efficiency of the coupler using the first and second parameters.
Abstract:
The light-emitting device includes a base substrate and preferably three light-emitting diodes respectively associated with three primary colors and emitting a part of their signal in the direction of the base substrate. The device includes three chromatic photodetectors formed in the base substrate constituting a semiconducting substrate, and each arranged under an associated light-emitting diode. Each chromatic photodetector includes superposed first, second and third layers. The first layer and third layer have a first type of conductivity and the second layer has a second type of conductivity. The device includes a control component connected to the chromatic photodetectors and to the light-emitting diodes to control the global color of the light emitted by the device.