Heat dissipation in hermetically-sealed packaged devices

    公开(公告)号:US10260782B2

    公开(公告)日:2019-04-16

    申请号:US15584544

    申请日:2017-05-02

    Abstract: A hermetically sealed package effectively dissipates heat generated inside the package. The hermetically sealed package includes a hermetically sealed enclosure formed from a base portion and a lid. Within the enclosure two or more heat generating elements, such as integrated circuit chips, are supported by the base portion and rise to different heights from the base portion. At least one resilient heat exchange component, such as a leaf spring, extends from the lid of the hermetically sealed enclosure to the different heights. The heat exchange component is configured to conduct heat from the plurality of heat generating elements to the lid of the enclosure.

    Real Time Strain Sensing Solution
    12.
    发明申请
    Real Time Strain Sensing Solution 有权
    实时应变传感解决方案

    公开(公告)号:US20150059487A1

    公开(公告)日:2015-03-05

    申请号:US14013103

    申请日:2013-08-29

    Abstract: Strain sensing may be provided. First, a strain threshold for a circuit board may be determined. Then a strain capacitor may be selected that will fail when the circuit board is subjected to the strain threshold while the strain capacitor is mounted on the circuit board. The strain capacitor may be ceramic and may be in a commercially available size. The strain capacitor may then be mounted to the circuit board and monitored for failure.

    Abstract translation: 可以提供应变感测。 首先,可以确定电路板的应变阈值。 然后可以选择应变电容器,当应变电容器安装在电路板上时,当电路板经受应变阈值时将失效。 应变电容器可以是陶瓷的,并且可以是市售的尺寸。 然后可以将应变电容器安装到电路板并监测故障。

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