公开(公告)号：US20050185253A1

公开(公告)日：2005-08-25

申请号：US10786665

申请日：2004-02-25

Applicant: Mario Rabinowitz ,  David Overhauser

Inventor： Mario Rabinowitz ,  David Overhauser

IPC: F24J2/10 ,  F24J2/54 ,  G02B26/00

CPC classification number: G02B26/00 ,  F24S23/70 ,  F24S23/77 ,  F24S30/425 ,  F24S2023/85 ,  F24S2023/87 ,  F24S2023/872 ,  Y02E10/47

Abstract: Due to an ever growing shortage of conventional energy sources, there is an increasingly intense interest in harnessing solar energy. The instant invention can contribute to the goal of achieving environmentally clean solar energy to be competitive with conventional energy sources. A novel method is described for manufacturing a transparent sheet with an embedded array of mirrored spheroidal micro-balls for use in a solar energy concentrator, and analogous applications such as optical switches and solar rocket assist. The micro-balls are covered with a thin spherical shell of lubricating liquid so that they are free to rotate in an almost frictionless encapsulation in the sheet. Novel method and apparatus are presented for producing the preferred embodiment of a close-packed monolayer of the array of mirrored micro-balls.

Abstract translation: 由于常规能源不断增加，对太阳能利用的兴趣日益增加。 本发明可以有助于实现环境清洁太阳能与常规能源竞争的目标。 描述了用于制造具有用于太阳能集中器的镜像球墨微球的嵌入阵列的透明片的新颖方法，以及诸如光开关和太阳能火箭辅助的类似应用。 微球用润滑液体的薄球形壳体覆盖，使得它们在片材中几乎无摩擦的封装中自由旋转。 提出了用于制造镜面微球阵列的紧密单层的优选实施方案的新方法和装置。

公开(公告)号：US08370779B1

公开(公告)日：2013-02-05

申请号：US13009826

申请日：2011-01-19

Applicant: Steffen Rochel ,  David Overhauser ,  Gregory Steele ,  Kung Hsu

Inventor： Steffen Rochel ,  David Overhauser ,  Gregory Steele ,  Kung Hsu

IPC: G06F17/50

CPC classification number: G06F17/5036 ,  G06F2217/78

Abstract: Disclosed are systems and methods for electrical verification of integrated circuits. Methodologies are described for verification of the power and ground distribution systems (PDS) for system-on-a-chip (SoC) and the verification of the interaction of the PDS with the behavior of integrated circuits.

公开(公告)号：US08370778B1

公开(公告)日：2013-02-05

申请号：US13009823

申请日：2011-01-19

Applicant: Steffen Rochel ,  David Overhauser ,  Gregory Steele ,  Kung Hsu

Inventor： Steffen Rochel ,  David Overhauser ,  Gregory Steele ,  Kung Hsu

IPC: G06F17/50

CPC classification number: G06F17/5036 ,  G06F2217/78

Abstract: Disclosed are systems and methods for electrical verification of integrated circuits. Methodologies are described for verification of the power and ground distribution systems (PDS) for system-on-a-chip (SoC) and the verification of the interaction of the PDS with the behavior of integrated circuits.

公开(公告)号：US06858939B1

公开(公告)日：2005-02-22

申请号：US09681776

申请日：2001-06-03

Applicant: Steven Teig ,  David Overhauser ,  Akira Fujimura

Inventor： Steven Teig ,  David Overhauser ,  Akira Fujimura

IPC: H01L23/528 ,  H01I23/48

CPC classification number: H01L23/528 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit has a metal layer that includes conductors to provide interconnectivity for components of the integrated circuit chip. The metal layer is divided into at least two sections, such that a first section has a preferred direction and the second section has a preferred wiring direction that is different from the first preferred direction. The first and second preferred directions on a single metal layer may consist of any direction. The metal layer may be divided into more than two sections, wherein each section has a preferred wiring direction. Wiring geometries for multi-level metal layers are also disclosed.

Abstract translation: 集成电路具有包括为集成电路芯片的组件提供互连的导体的金属层。 金属层被分成至少两个部分，使得第一部分具有优选的方向，并且第二部分具有不同于第一优选方向的优选的布线方向。 单个金属层上的第一和第二优选方向可由任何方向组成。 金属层可以被分成多于两个部分，其中每个部分具有优选的布线方向。 还公开了多层金属层的接线几何形状。