公开(公告)号：US20200166442A1

公开(公告)日：2020-05-28

申请号：US16630746

申请日：2018-04-30

申请人： Dow Global Technologies LLC

发明人： Sanjay C. Solanki ,  Donald L. McCarty, II ,  Robert A. Gunther ,  Jin Wang ,  Kyle A. Myers ,  Scott J. Collick

IPC分类号： G01N3/08 ,  G01N33/44

摘要： A method and a system for analyzing a physical characteristic of a film sample are described herein. The system includes a material holder system configured to hold the film sample; and a tear analysis device configured to tear the film sample and measure a characteristic of the tear. The movable system is configured to move the film sample in the material holder system to the tear analysis device.