摘要:
A semiconductor memory device may include a semiconductor substrate, a control gate electrode recessed in the semiconductor substrate, a storage node layer between the control gate electrode and the semiconductor substrate, a tunneling insulating layer between the storage node layer and the semiconductor substrate, a blocking insulating layer between the storage node layer and the control gate electrode, and first and second channel regions surrounding the control gate electrode and separated by a pair of opposing separating insulating layers. A method of operating the semiconductor memory device may include programming data in the storage node layer by charge tunneling through the blocking insulating layer, thus achieving relatively high reliability and efficiency.
摘要:
Crystalline aluminum oxide layers having increased energy band gap, charge trap memory devices including crystalline aluminum oxide layers and methods of manufacturing the same are provided. A method of forming an aluminum oxide layer having an increased energy band gap includes forming an amorphous aluminum oxide layer on a lower film, introducing hydrogen (H) or hydroxyl group (OH) into the amorphous aluminum oxide layer, and crystallizing the amorphous aluminum oxide layer including the H or OH.
摘要:
A method of programming a nonvolatile memory device may include applying a program voltage to a memory cell. A supplementary pulse may be applied to the memory cell to facilitate thermalization of charges after the application of the program voltage. A recovery voltage may be applied to the memory cell after the application of the supplementary pulse. A program state of the memory cell may be verified using a verification voltage after the application of the recovery voltage.
摘要:
Provided are a gate stack, a capacitorless dynamic random access memory (DRAM) including the gate stack and methods of manufacturing and operating the same. The gate stack for a capacitorless DRAM may include a tunnel insulating layer on a substrate, a first charge trapping layer on the tunnel insulating layer, an interlayer insulating layer on the first charge trapping layer, a second charge trapping layer on the interlayer insulating layer, a blocking insulating layer on the second charge trapping layer, and a gate electrode on the blocking insulating layer. The capacitorless DRAM may include the gate stack on the substrate, and a source and a drain in the substrate on both sides of the gate stack.
摘要:
Crystalline aluminum oxide layers having increased energy band gap, charge trap memory devices including crystalline aluminum oxide layers and methods of manufacturing the same are provided. A method of forming an aluminum oxide layer having an increased energy band gap includes forming an amorphous aluminum oxide layer on a lower film, introducing hydrogen (H) or hydroxyl group (OH) into the amorphous aluminum oxide layer, and crystallizing the amorphous aluminum oxide layer including the H or OH.
摘要:
A method of programming a memory device may include applying a program voltage to a memory cell of the memory device and consecutively applying a plurality of verifying voltages to the memory cell. The verifying voltages may be consecutively applied with a same voltage magnitude after applying the program voltage. The verifying voltages may be consecutively applied with sequentially decreasing magnitudes after applying the program voltage.
摘要:
Provided are a non-volatile memory device and a method of manufacturing the non-volatile memory device. The non-volatile memory device includes a charge trap layer having a crystalline material. In the method, a tunneling insulating layer is formed on a substrate, and a crystalline charge trap layer is formed on the tunneling insulating layer.
摘要:
A non-volatile memory cell programming method is provided. A memory cell programming method of programming 2-bit data in a memory cell having 4 threshold voltage distributions may comprise: a first program operation of programming a first bit of the 2-bit data in the memory cell by applying a first programming voltage to the memory cell; a second program operation of programming a second bit of the 2-bit data in the memory cell by applying a second programming voltage to the memory cell; and a stabilization operation of applying a stabilization voltage having an electric field opposite in polarity to an electric field formed by the first and second programming voltages to the memory cell after one of the first and second program operations that corresponds to a higher one of the first and second programming voltages is performed.
摘要:
Provided is a method of programming a memory device. The method includes performing a program voltage applying operation; and performing a verifying operation, wherein a plurality of verifying operations are consecutively performed after a program voltage applying operation.
摘要:
Provided are a charge trap memory device and a method of manufacturing the same. The charge trap memory device may comprise a gate structure including a plurality of metal oxide nanodots discontinuously arranged as a charge trap site on a substrate.