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公开(公告)号:US20210193629A1
公开(公告)日:2021-06-24
申请号:US16995850
申请日:2020-08-18
Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
Inventor: Kailiang FAN , Kuai QIN , Heng GUO , Qiang ZHAO , Zongxian XIE , Chungan JIANG
IPC: H01L25/075
Abstract: Some embodiments provide a full-color display module and display device. The full-color display module includes at least two light-emitting layers. Any one of the at least two light-emitting layers includes a substrate and a plurality of light-emitting portions encapsulated on the substrate. A type of any one of the plurality of light-emitting portions is one of a red light-emitting portion, a green light-emitting portion, and a blue light-emitting portion. The at least two light-emitting layers are successively laminated in a laminating direction and form a plurality of pixel points. Any one of the plurality of pixel points is a surrounding area on the full-color display module, which is surrounded by a surrounding curved surface. The surrounding area of the any one of the plurality of pixel points includes at least one red light-emitting portion, at least one green light-emitting portion, and at least one blue light-emitting portion.
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12.
公开(公告)号:US20190244939A1
公开(公告)日:2019-08-08
申请号:US16340150
申请日:2017-10-17
Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
Inventor: Chuanbiao LIU , Xiaofeng LIU , Feng GU , Kuai QIN
IPC: H01L25/075
Abstract: A Chip-on-Board (COB) display module is provided, which includes a Printed Circuit Board (PCB) a plurality of Light-Emitting Diode (LED) luminous units, a packaging adhesive layer and a light shielding layer wherein the plurality of LED luminous units are mounted and fixed on the PCB, the packaging adhesive layer covers the PCB and wraps the LED luminous units thereon, a liquid passage is provided in the packaging adhesive layer between every two adjacent LED luminous units, and the light shielding layer fills the liquid passage. The COB display module further includes a reflecting layer, and the reflecting layer covers two sidewalls of the liquid passage, and is positioned between the packaging adhesive layer and the light shielding layer. A manufacturing method for the COB display module is also disclosed.
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