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公开(公告)号：US09027504B2
公开(公告)日：2015-05-12
申请号：US13484625
申请日：2012-05-31
申请人： Hidenori Miyamoto , Tsutomu Sahoda
发明人： Hidenori Miyamoto , Tsutomu Sahoda
IPC分类号： B05C13/02 , F24J3/00 , F27B5/16 , H01L21/67 , H01L21/677 , H01L31/032
CPC分类号： H01L21/67173 , H01L21/67109 , H01L21/67253 , H01L21/6776 , H01L31/0322 , H01L31/0326 , Y02E10/541
摘要： A heating apparatus including: a first heating part and a second heating part between which a substrate having a coating film is disposed at a substrate position in the film thickness direction; and a distance control part which controls at least one of a first distance between the substrate position and the first heating part and a second distance between the substrate position and the second heating part.
摘要翻译： 一种加热装置，包括：第一加热部和第二加热部，在所述第一加热部和第二加热部之间，在所述膜厚度方向的基板位置配置有具有涂膜的基板; 以及距离控制部，其控制所述基板位置与所述第一加热部之间的第一距离和所述基板位置与所述第二加热部之间的第二距离中的至少一个。
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公开(公告)号：US20120238075A1
公开(公告)日：2012-09-20
申请号：US13412910
申请日：2012-03-06
申请人： Hidenori Miyamoto , Tsutomu Sahoda
发明人： Hidenori Miyamoto , Tsutomu Sahoda
IPC分类号： H01L21/208 , B05B1/02 , B05B15/04
CPC分类号： C23C2/003 , C23C18/12 , C23C18/1204 , C23C18/1275 , C23C26/02 , H01L21/6715 , H01L21/67173 , H01L21/6776 , Y02E10/541 , Y02P70/521
摘要： A coating apparatus including a coating part which applies a liquid material containing an oxidizable metal and a solvent to a substrate; a chamber having a coating space in which the coating part applies the liquid material to the substrate and a transport space into which the substrate is transported; and a removal part which removes the liquid material from the atmosphere inside the chamber when a concentration of the solvent in the atmosphere inside the chamber exceeds a threshold value.
摘要翻译： 一种涂布设备，包括：将含有可氧化金属和溶剂的液体材料施加到基材上的涂布部分; 一个具有涂层空间的腔室，其中涂层部分将液体材料施加到衬底上，以及传送空间，衬底被运送到该腔室中; 以及当室内的大气中的溶剂的浓度超过阈值时，从室内的大气中除去液体物质的去除部。
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公开(公告)号：US20120304921A1
公开(公告)日：2012-12-06
申请号：US13484625
申请日：2012-05-31
申请人： Hidenori Miyamoto , Tsutomu Sahoda
发明人： Hidenori Miyamoto , Tsutomu Sahoda
CPC分类号： H01L21/67173 , H01L21/67109 , H01L21/67253 , H01L21/6776 , H01L31/0322 , H01L31/0326 , Y02E10/541
摘要： A heating apparatus including: a first heating part and a second heating part between which a substrate having a coating film is disposed at a substrate position in the film thickness direction; and a distance control part which controls at least one of a first distance between the substrate position and the first heating part and a second distance between the substrate position and the second heating part.
摘要翻译： 一种加热装置，包括：第一加热部和第二加热部，在所述第一加热部和第二加热部之间，在所述膜厚度方向的基板位置配置有具有涂膜的基板; 以及距离控制部，其控制所述基板位置与所述第一加热部之间的第一距离和所述基板位置与所述第二加热部之间的第二距离中的至少一个。
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公开(公告)号：US5332557A
公开(公告)日：1994-07-26
申请号：US5602
申请日：1993-01-19
IPC分类号： B01J19/00 , C03C17/25 , C23C18/12 , G05D23/22 , H01L21/00 , H01L21/324 , H01L21/677 , F28D21/00 , G05D23/19 , H05H1/24
CPC分类号： H01L21/67757 , G05D23/1934 , G05D23/22 , H01L21/67115 , Y10S422/906
摘要： A plurality of workpieces are supported on a workpiece holder disposed over an opening defined in a horizontal base plate and connected to an evacuating device. A reaction chamber, which is supported on an arm of a lifting and lowering device, is vertically movable with respect to the base plate between a lowered position in which the reaction chamber defines a closed space which accommodates the workpieces therein and a lifted position in which the workpieces are exposed out of the reaction chamber. A heating device, which is supported on an arm of another lifting and lowering device, is vertically movable with respect to the base plate between a lowered position in which the heating device surrounds the reaction chamber and a lifted position in which the reaction chamber is exposed out of the heating device.
摘要翻译： 多个工件被支撑在设置在水平基板中限定的开口上并连接到抽空装置的工件保持件上。 支撑在提升和降低装置的臂上的反应室可在下降位置之间相对于基板垂直移动，其中反应室限定容纳工件的封闭空间和提升位置， 工件暴露在反应室外。 支撑在另一升降装置的臂上的加热装置可相对于基板垂直移动，该下降位置在加热装置围绕反应室的下降位置和反应室暴露于其中的提升位置之间 离开加热装置。
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公开(公告)号：US20120309179A1
公开(公告)日：2012-12-06
申请号：US13484642
申请日：2012-05-31
申请人： Hidenori Miyamoto , Tsutomu Sahoda
发明人： Hidenori Miyamoto , Tsutomu Sahoda
IPC分类号： H01L21/208 , B05C9/14
CPC分类号： H01L31/18 , H01L31/0322 , H01L31/0326 , Y02E10/541
摘要： A substrate treating apparatus including: a first chamber having a coating part which forms a coating film of a liquid material containing an oxidizable metal and a solvent on a substrate; a second chamber having a first heating part which heats the coating film; and a connection part which connects the first chamber and the second chamber, wherein the connection part is provided with a second heating part which heats the coating film coated on the substrate and a pressure control part which controls the pressure around the coating film.
摘要翻译： 一种基板处理装置，包括：第一室，其具有涂布部，其在基板上形成含有可氧化金属和溶剂的液体材料的涂膜; 第二室，具有加热涂膜的第一加热部; 以及连接第一室和第二室的连接部，其中，连接部设置有加热涂布在基板上的涂膜的第二加热部和控制涂膜周围的压力的压力控制部。
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公开(公告)号：US20120308715A1
公开(公告)日：2012-12-06
申请号：US13484728
申请日：2012-05-31
申请人： Hidenori Miyamoto , Tsutomu Sahoda
发明人： Hidenori Miyamoto , Tsutomu Sahoda
IPC分类号： H01L31/18
CPC分类号： H01L21/6715 , H01L21/67173 , H01L21/6776 , Y02E10/541
摘要： A coating apparatus including: a coating part having a nozzle which ejects a liquid material containing an oxidizable metal and a solvent to a substrate; a supplying system which supplies the liquid material to the coating part; and a recycling system which recovers the liquid material from at least one of the supplying system and the coating part, and supplies the recovered liquid material to at least one of the supplying system and the coating part.
摘要翻译： 一种涂布装置，包括：涂布部，其具有将含有可氧化金属和溶剂的液体材料喷射到基材的喷嘴; 供给系统，其将液体材料供给到涂布部; 以及回收系统，其从供给系统和涂布部中的至少一个回收液体材料，并将回收的液体材料供给到供给系统和涂布部中的至少一个。
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公开(公告)号：US5879457A
公开(公告)日：1999-03-09
申请号：US783988
申请日：1997-01-14
申请人： Tsutomu Sahoda , Koji Ueda , Hiroki Endo , Hidenori Miyamoto
发明人： Tsutomu Sahoda , Koji Ueda , Hiroki Endo , Hidenori Miyamoto
CPC分类号： H01L21/6715 , B05C11/08
摘要： A rotating cup type liquid coating device with structure for suppressing pulsatory movement of the coated liquid when stopping rotation of the inner cup 3, includes a buffer space S formed for connecting an inner space of the inner cup 3 and an inner space of an outer cup 2 surrounding the inner cup, on an outer periphery of the inner cup 3 , through respective throttle portions 16, 17.
摘要翻译： 具有用于在停止内杯3的旋转时抑制被涂液体的脉动运动的结构的旋转杯式液体涂布装置包括形成为用于连接内杯3的内部空间和外杯的内部空间的缓冲空间S 2通过相应的节流部分16,17围绕内杯3在内杯3的外周上。
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公开(公告)号：US5706930A
公开(公告)日：1998-01-13
申请号：US637356
申请日：1996-04-24
申请人： Tsutomu Sahoda , Koji Ueda , Hidenori Miyamoto , Toru Arikawa
发明人： Tsutomu Sahoda , Koji Ueda , Hidenori Miyamoto , Toru Arikawa
IPC分类号： B65G49/07 , H01L21/027 , H01L21/677 , H01L21/68 , B65G29/00
CPC分类号： H01L21/681 , H01L21/67796 , Y10S414/135
摘要： When a carrier arm is retracted, a semiconductor wafer carried thereon passes between three light-emitting elements and three light-detecting elements associated therewith. At this time, a controller determines six points on the outer circumferential edge of the semiconductor wafer based on signals from sensors made up of the light-emitting elements and the light-detecting elements. The controller selects three of the determined points, determines the center of a circumscribed circle passing through the selected three points, and regards the determined center as the center of the semiconductor wafer. Then, the controller controls movement of the semiconductor wafer toward a rotary-cup coating device, an evacuating drying device, or an edge cleaning device based on the center of the semiconductor wafer.
摘要翻译： 当承载臂缩回时，其上承载的半导体晶片通过三个发光元件和与其相关联的三个光检测元件。 此时，控制器基于由发光元件和光检测元件构成的传感器的信号来确定半导体晶片的外周边缘上的六个点。 控制器选择三个确定的点，确定通过所选三个点的外接圆的中心，并将确定的中心视为半导体晶片的中心。 然后，控制器基于半导体晶片的中心来控制半导体晶片朝向旋转杯式涂布装置，抽真空干燥装置或边缘清洁装置的移动。
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