公开(公告)号：US20180043642A1

公开(公告)日：2018-02-15

申请号：US15234128

申请日：2016-08-11

Applicant: GM Global Technology Operations LLC

Inventor： Jason M. Miller

IPC: B29C70/46 ,  B29C35/02 ,  B29C33/10 ,  B29C70/54

CPC classification number: B29C70/467 ,  B29C33/10 ,  B29C35/0261 ,  B29C70/46 ,  B29C70/48 ,  B29C70/54 ,  B29C70/541 ,  B29K2063/00 ,  B29K2707/04 ,  B29L2031/30

Abstract: A number of variations may include a method comprising: providing a mold apparatus comprising at least a first compression mold apparatus member, at least a second compression mold apparatus member, a preform, and a resin, wherein at least one of the first compression mold apparatus member or the second compression mold apparatus member comprises at least one ultrasound emitter; introducing at least one of the preform or the resin into at least one of the first compression mold apparatus member or the second compression mold apparatus member; contacting the first compression mold apparatus member to at least the second compression mold apparatus member to form a closed mold cavity; pressurizing and heating the mold cavity; and curing at least one of the resin or preform using the ultrasound emitter to form a molded component within the mold cavity.