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公开(公告)号：US20220099886A1
公开(公告)日：2022-03-31
申请号：US17036827
申请日：2020-09-29
Applicant: Google LLC
Inventor： Liming Wang , Ryohei Urata , Jan Petykiewicz , Jill Berger
Abstract: A photonic integrated circuit chip includes a substrate and a wafer on the substrate. The wafer itself includes a photonic grating coupler with a taper portion and grating features. The grating features extend from the taper portion toward the substrate.
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