公开(公告)号：US20220336324A1

公开(公告)日：2022-10-20

申请号：US17760722

申请日：2020-08-14

Applicant: HITACHI ASTEMO, LTD.

Inventor： Nobutake TSUYUNO ,  Yujiro KANEKO ,  Akira MATSUSHITA ,  Masahito MOCHIZUKI ,  Eiichi IDE ,  Junpei KUSUKAWA

IPC: H01L23/473 ,  H02M7/00 ,  H02M7/5387 ,  H05K7/20 ,  H01L25/07 ,  H01L21/48

Abstract: A sheet-shaped member 440 including a resin insulating layer 441 and a metal foil 442 is used. The sheet-shaped member 440 is deformed following warpage or step difference in a second conductor plate 431 and a fourth conductor plate 433, and therefore, the thickness of the resin insulating layer 441 can be set to a constant thickness of, for example, 120 μm capable of securing insulation properties. By plastically deforming a metal-based heat conduction member 450 having a thickness of, for example, 120 μm interposed between the sheet-shaped member 440 and a cooling member 340, the thickness of the metal-based heat conduction member 450 is changed to absorb the warpage or step difference generated in the second conductor plate 431 and the fourth conductor plate 433. This results in remarkable improvement in heat dissipation as compared with a case where the conductor plates are brought into contact with the cooling member 340 via an insulating layer alone.