Light source backup method, apparatus, and system

    公开(公告)号:US11411652B2

    公开(公告)日:2022-08-09

    申请号:US17245958

    申请日:2021-04-30

    Abstract: This application provides an example light source switching apparatus. The apparatus includes first and second multi-mode interference (MMI) couplers, and a phase modulator. The first MMI coupler includes four ports, where first and second ports are located on one side, and third and fourth ports are located on the other side. The second MMI coupler includes three ports, where fifth and sixth ports are located on one side, and a seventh port is located on the other side. The first and the second ports connect to the fifth and the sixth ports, respectively, to form two connections. The phase modulator is disposed on one of the two connections, and the seventh port connects to an optical modulator. Both the third and the fourth ports connect to a light source emitting continuous light, and the phase modulator selects one of the two light sources for output from the seventh port.

    ELECTRO-OPTIC MODULATOR
    12.
    发明申请

    公开(公告)号:US20190171044A1

    公开(公告)日:2019-06-06

    申请号:US16252450

    申请日:2019-01-18

    CPC classification number: G02F1/025 G02F1/015 G02F2001/0151

    Abstract: An electro-optic modulator includes an input waveguide, a beam splitter connected to the input waveguide, a modulation arm that is disposed on each branch of the beam splitter and modulates a signal. Each modulation arm is correspondingly disposed with a first layer electrode and a second layer electrode. The first layer electrode is a high-frequency traveling wave electrode and is configured to change carrier concentration in the modulation arm, the second layer electrode is a direct current electrode having an inductor function, and an inductor formed in the second layer electrode is connected to the first layer electrode. The electro-optic modulator has functions of a bias tee, so that integration of the electro-optic modulator can be improved without affecting its performance. High-density packaging layout difficulty and cabling pressure can be effectively reduced, and cabling and packaging of a multi-channel high-speed signal on a base board can be implemented.

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