公开(公告)号：US20210257303A1

公开(公告)日：2021-08-19

申请号：US17306807

申请日：2021-05-03

Applicant: Intel Corporation

Inventor： Amruthavalli Pallavi ALUR ,  Sri Ranga Sai BOYAPATI ,  Robert Alan MAY ,  Islam A. SALAMA ,  Robert L. SANKMAN

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L21/48 ,  H01L25/00 ,  H01L25/18 ,  H01L23/31

Abstract: An embedded multi-die interconnect bridge apparatus and method includes photolithographically formed interconnects coupled to laser-drilled interconnects. Several structures in the embedded multi-die interconnect bridge apparatus exhibit characteristic planarization during fabrication and assembly.

公开(公告)号：US20200303310A1

公开(公告)日：2020-09-24

申请号：US16889735

申请日：2020-06-01

Applicant: Intel Corporation

Inventor： Amruthavalli Pallavi ALUR ,  Sri Ranga Sai BOYAPATI ,  Robert Alan MAY ,  Islam A. SALAMA ,  Robert L. SANKMAN

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L21/48 ,  H01L25/00 ,  H01L25/18 ,  H01L23/31

Abstract: An embedded multi-die interconnect bridge apparatus and method includes photolithographically formed interconnects coupled to laser-drilled interconnects. Several structures in the embedded multi-die interconnect bridge apparatus exhibit characteristic planarization during fabrication and assembly.