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公开(公告)号：US10134690B2
公开(公告)日：2018-11-20
申请号：US15335999
申请日：2016-10-27
Applicant: Intel Corporation
Inventor： Hao-Han Hsu , Ying Ern Ho , Jaejin Lee
IPC: H01L23/00 , H01L23/66 , H01L23/498
Abstract: Embodiments herein may relate to a package with one or more layers. A silicon die may be coupled with the one or more layers via an adhesive. A package stiffener may also be coupled with the adhesive adjacent to the die. A magnetic thin film may be coupled with the package stiffener. Other embodiments may be described and/or claimed.
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