CAPACITOR AND FABRICATION METHOD USING ULTRA-HIGH VACUUM CVD OF SILICON NITRIDE
    12.
    发明申请
    CAPACITOR AND FABRICATION METHOD USING ULTRA-HIGH VACUUM CVD OF SILICON NITRIDE 审中-公开
    使用氮化硅超高真空CVD的电容器和制造方法

    公开(公告)号:US20050054156A1

    公开(公告)日:2005-03-10

    申请号:US10605128

    申请日:2003-09-10

    摘要: A method of fabricating a capacitor including an ultra-high vacuum chemical vapor deposition (UHVCVD) step to generate a top-side barrier film layer including silicon nitride at monolayer quantities, and a capacitor so formed, are disclosed. The UHVCVD step allows silicon nitride to be deposited with monolayer level control, and is more successful at placing the nitrogen near the top surface independent of the base film thickness. The resulting capacitor exhibits thermal stability and meets leakage targets after, for example, an approximately 1050° C. thermal treatment. In addition, the UHVCVD nitride step allows for an in situ thermal clean and simpler process control because the reaction is thermally driven.

    摘要翻译: 公开了一种制造包括超高真空化学气相沉积(UHVCVD)步骤的电容器的方法,以生成包括单层量的氮化硅的顶侧阻挡膜层和如此形成的电容器。 UHVCVD步骤允许氮化硅沉积单层水平控制,并且在顶部表面附近放置氮而与基膜厚度无关的情况下更为成功。 所得到的电容器在例如约1050℃热处理之后具有热稳定性并满足泄漏目标。 此外,UHVCVD氮化物步骤允许原位热清洁和更简单的过程控制,因为反应是热驱动的。