公开(公告)号：US20110241609A1

公开(公告)日：2011-10-06

申请号：US12833662

申请日：2010-07-09

申请人： Jae Won CHOI ,  Eung Ju KIM ,  Kwang Du LEE ,  Chul Gyun PARK ,  Jeong Hoon KIM ,  Jung Ho YOON ,  Sang Hoon HWANG ,  Chul Hun SEO

发明人： Jae Won CHOI ,  Eung Ju KIM ,  Kwang Du LEE ,  Chul Gyun PARK ,  Jeong Hoon KIM ,  Jung Ho YOON ,  Sang Hoon HWANG ,  Chul Hun SEO

IPC分类号： H02J7/00

CPC分类号： H02J50/12 ,  H02J5/005 ,  H02J50/40

摘要： Disclosed herein is a wireless energy transmission structure, which includes a printed circuit board, a disk section, and a wire section. The printed circuit board is formed in a ring type, the disk section is constituted by a first conductive plate and a second conductive plate formed on portions of the printed circuit board corresponding to each other to be spaced by a predetermined gap and a dielectric material inserted between the first conductive plate and the second conductive plate, and the wire section is constituted by a plurality of meta cells having a meta material structure, which are repetitively formed to surround the exterior and interior of the printed circuit board and a transmission line connected to each of the first conductive plate and the second conductive plate and surround the plurality of meta cells.

摘要翻译： 这里公开了一种无线能量传输结构，其包括印刷电路板，磁盘部分和电线部分。 印刷电路板形成为环形，盘部由第一导电板和第二导电板构成，第一导电板和第二导电板形成在印刷电路板的彼此对应的部分上，以间隔开预定的间隙，并且介电材料插入 在所述第一导电板和所述第二导电板之间，并且所述导线部分由多个元件结构构成，所述元件具有重复形成以围绕所述印刷电路板的外部和内部;以及传输线， 每个第一导电板和第二导电板，并且围绕多个元电池。

公开(公告)号：US20110159284A1

公开(公告)日：2011-06-30

申请号：US12970004

申请日：2010-12-16

申请人： Jae Won CHOI ,  Jin Man Kim ,  Ki Tae Song

发明人： Jae Won CHOI ,  Jin Man Kim ,  Ki Tae Song

IPC分类号： C09J163/00 ,  C09J163/02 ,  C09J163/04 ,  B32B27/38

CPC分类号： C08G59/38 ,  C08L21/00 ,  C08L63/00 ,  C08L63/04 ,  C08L2205/02 ,  C09J163/00 ,  Y10T428/287

摘要： An adhesive composition for a semiconductor device and a die attach film for a semiconductor device, the adhesive composition including about 50 to about 80 parts by weight of an elastomeric resin; about 10 to about 20 parts by weight of an epoxy resin, the epoxy resin including a difunctional epoxy resin and polyfunctional epoxy resins and the difunctional epoxy resin being present in an amount of about 20 to about 60 parts by weight with respect to 100 parts by weight of the epoxy resin; about 1 to about 10 parts by weight of a curable resin; about 0.01 to about 10 parts by weight of a curing accelerator; about 0.01 to about 10 parts by weight of a silane coupling agent; and about 5 to about 10 parts by weight of a filler.

摘要翻译： 用于半导体器件的粘合剂组合物和用于半导体器件的芯片附着膜，所述粘合剂组合物包含约50至约80重量份的弹性体树脂; 约10至约20重量份的环氧树脂，环氧树脂包括双官能环氧树脂和多官能环氧树脂，双官能环氧树脂以相对于100份的约20至约60重量份的量存在 环氧树脂的重量; 约1至约10重量份的可固化树脂; 约0.01至约10重量份的固化促进剂; 约0.01至约10重量份的硅烷偶联剂; 和约5至约10重量份的填料。