公开(公告)号：US09767548B2

公开(公告)日：2017-09-19

申请号：US15135465

申请日：2016-04-21

Applicant: KLA-Tencor Corporation

Inventor： Saibal Banerjee ,  Ashok V. Kulkarni

IPC: G06K9/00 ,  G06T7/00

CPC classification number: G06T7/001 ,  G06T2207/20021 ,  G06T2207/30148

Abstract: Methods and systems for identifying outliers in multiple instances of a pattern of interest (POI) are provided. One system includes one or more computer subsystems configured for acquiring images generated by an imaging subsystem at multiple instances of a POI within a die formed on the specimen. The multiple instances include two or more instances that are located at aperiodic locations within the die. The computer subsystem(s) are also configured for determining a feature of each of the images generated at the multiple instances of the POI. In addition, the computer subsystem(s) are configured for identifying one or more outliers in the multiple instances of the POI based on the determined features.

公开(公告)号：US09098891B2

公开(公告)日：2015-08-04

申请号：US14228023

申请日：2014-03-27

Applicant: KLA-Tencor Corporation

Inventor： Ashok V. Kulkarni ,  Saibal Banerjee

IPC: G06K9/00 ,  G06T7/00

CPC classification number: G06T7/0004 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Methods and systems for adaptive sampling for semiconductor inspection recipe creation, defect review, and metrology are provided. The embodiments provide image processing and pattern recognition algorithms and an adaptive sampling method for extracting critical areas from SEM image patches for use in a wafer inspection system when design data for a semiconductor chip is not available. The embodiments also provide image processing and pattern recognition algorithms for efficiently discovering critical defects and significant deviations in the normal manufacturing process, using the output from a wafer inspection system and an adaptive sampling method to select wafer locations to be examined on a high resolution review or metrology tool.

Abstract translation: 提供了用于半导体检测配方创建，缺陷检查和计量的自适应采样的方法和系统。 实施例提供了图像处理和模式识别算法以及用于在半导体芯片的设计数据不可用时从用于晶片检查系统的SEM图像补片提取临界区域的自适应采样方法。 实施例还提供图像处理和模式识别算法，用于在正常制造过程中有效地发现关键缺陷和显着偏差，使用晶片检查系统的输出和自适应采样方法来选择要在高分辨率检查中检查的晶片位置， 计量工具