公开(公告)号：US06868105B2

公开(公告)日：2005-03-15

申请号：US10351488

申请日：2003-01-27

申请人： Ayumi Yagi ,  Kazunori Matsubara

发明人： Ayumi Yagi ,  Kazunori Matsubara

IPC分类号： G11B7/125 ,  G11B7/22 ,  H01S5/02 ,  H01S5/022 ,  H01S3/04 ,  H01S5/00

CPC分类号： H01S5/02216 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01S5/02244 ,  H01S5/02248 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor laser device that is suitable for mass production, that permits an improved wire layout, and that permits miniaturization includes leads disposed through each of two side faces of an insulating frame member so as to run from outside to inside the insulating frame member, an LD and a light-receiving element mounted inside the insulating frame member, and wires laid inside the insulating frame member so as to connect the leads to the electrodes of the LD and the light-receiving element. Inside the insulating frame member, the tip of one lead is extended farther inward than the edge of an element mount portion that faces the tip of another lead that is disposed through the same side face of the insulating frame member.

摘要翻译： 一种适用于批量生产的半导体激光装置，其允许改进的布线布局，并且允许小型化包括通过绝缘框架构件的两个侧面中的每一个设置成从外部延伸到绝缘框架构件内部的引线， LD和安装在绝缘框架构件内部的光接收元件以及布置在绝缘框架构件内部的导线，以将引线连接到LD和光接收元件的电极。 在绝缘框架构件的内部，一个引线的尖端比元件安装部分的与绝缘框架构件的相同侧面设置的另一引线的尖端相对的边缘更向内延伸。

公开(公告)号：US07173951B2

公开(公告)日：2007-02-06

申请号：US10777190

申请日：2004-02-13

申请人： Hisayuki Shinohara ,  Ayumi Yagi ,  Kazunori Matsubara ,  Tetsuyoshi Inoue

发明人： Hisayuki Shinohara ,  Ayumi Yagi ,  Kazunori Matsubara ,  Tetsuyoshi Inoue

IPC分类号： H01S3/04

CPC分类号： H01S5/02288 ,  G11B7/123 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01S5/02216 ,  H01S5/02292

摘要： A semiconductor laser device includes a package having a front surface, a rear surface and an outer peripheral surface; a semiconductor laser element and a light receiving element provided on the front surface; a plurality of leads arranged in spaced relation on the front surface as extending outward from the package; and an optical element supported above the front surface with its optical axis perpendicular to the front surface for guiding a laser beam emitted from the semiconductor laser element toward an object and guiding light reflected on the object to the light receiving element; wherein the outer peripheral surface is configured so as to be fitted in a cylindrical hole having an axis parallel to the optical axis of the optical element, and has a recess extending from the front surface to the rear surface, and the leads are bent as extending from the front surface and passing through the recess with distal portions thereof extending along the optical axis of the optical element and with proximal ends thereof electrically connected to the semiconductor laser element and the light receiving element.

摘要翻译： 半导体激光装置包括：具有前表面，后表面和外周面的封装; 半导体激光元件和设置在前表面上的光接收元件; 在前表面上以间隔开的方式布置成从包装向外延伸的多个引线; 以及支撑在前表面上的光学元件，其光轴垂直于前表面，用于将从半导体激光元件发射的激光束朝向物体引导并将在物体上反射的光引导到光接收元件; 其特征在于，所述外周面配置成具有与所述光学元件的光轴平行的轴的圆筒状孔，并且具有从所述前表面延伸到所述后表面的凹部，并且所述引线被弯曲成延伸 从前表面通过凹部，其远端部分沿着光学元件的光轴延伸，并且其近端电连接到半导体激光元件和光接收元件。

公开(公告)号：US20060018351A1

公开(公告)日：2006-01-26

申请号：US11185838

申请日：2005-07-21

申请人： Kazunori Matsubara ,  Takeshi Horiguchi ,  Hideshi Koizumi

发明人： Kazunori Matsubara ,  Takeshi Horiguchi ,  Hideshi Koizumi

IPC分类号： H01S5/00 ,  H01S3/04

CPC分类号： H01S5/02292 ,  H01S5/02208 ,  H01S5/02248 ,  H01S5/02252 ,  H01S5/02296 ,  H01S5/0683

摘要： In a semiconductor laser device, a wiring board (101) has pad patterns on its top surface, on which a block (102) is also mounted. The block (102) has a first mounting surface (113) and a second mounting surface (114), both of which face in an identical direction. The block (102) also has a raising mirror (111) for changing an optical axis of light. On the first mounting surface (113) is mounted a semiconductor laser element (103) which emits laser light (L). On the second mounting surface (114) is mounted a light receiving element (104) which receives reflected light of the laser light (L).

摘要翻译： 在半导体激光装置中，布线基板（101）的顶面具有垫片图案，并且还安装有块体（102）。 块（102）具有第一安装表面（113）和第二安装表面（114），它们都面向相同的方向。 块（102）还具有用于改变光轴的升高镜（111）。 在第一安装面（113）上安装有发射激光（L）的半导体激光元件（103）。 在第二安装表面（114）上安装有接收激光（L）的反射光的光接收元件（104）。

公开(公告)号：US07099085B2

公开(公告)日：2006-08-29

申请号：US10723888

申请日：2003-11-26

申请人： Shigehiro Yamada ,  Takashi Itoh ,  Nobumasa Kaneko ,  Kazunori Matsubara

发明人： Shigehiro Yamada ,  Takashi Itoh ,  Nobumasa Kaneko ,  Kazunori Matsubara

IPC分类号： G02B5/18

CPC分类号： G11B7/123 ,  G11B7/1353 ,  G11B2007/13727

摘要： An optical pick-up apparatus and a semiconductor laser apparatus which can suppress reduction of optical utilization efficiency for the laser light emitted from the semiconductor laser element. When a laser light which is emitted from a laser element for DVD and whose polarization direction is perpendicular to a direction of a groove of the polarization grating is incident on the polarization grating, the polarization grating does not diffract the laser light and transmits the laser light as zero-order diffraction light. Consequently, all of the laser light emitted from the laser element for DVD can be used for reading information signal of DVD and detecting FES and TES. This enables reduction of optical utilization efficiency arising by diffracting action of a grating used for detecting TES of CD in a conventional optical pick-up apparatus to be suppressed.

摘要翻译： 一种能够抑制从半导体激光元件发射的激光的光学利用效率降低的光学拾取装置和半导体激光装置。 当从用于DVD的激光元件发射并且其偏振方向垂直于偏振光栅的凹槽的方向的激光入射到偏振光栅上时，偏振光栅不会衍射激光并透射激光 作为零级衍射光。 因此，从DVD的激光元件发射的所有激光可用于读取DVD的信息信号并检测FES和TES。 由此，能够抑制由常规的光学拾取装置中用于检测CD的TES的光栅的衍射作用引起的光学利用效率的降低。

公开(公告)号：US07088754B2

公开(公告)日：2006-08-08

申请号：US10738978

申请日：2003-12-19

申请人： Kazunori Matsubara

发明人： Kazunori Matsubara

IPC分类号： H01S5/00

CPC分类号： H01S5/02292 ,  G11B7/123 ,  H01S5/02216 ,  H01S5/02248 ,  H01S5/02296

摘要： The present invention provides a semiconductor laser devices of hologram laser type, constructed so that the configuration of the optical elements barely changes even if its package expands due to a rise in temperature or moisture absorption. In the semiconductor laser device, a body frame made of an insulating resin contains a semiconductor laser element, a mirror, a photo-detecting element for reading signals, a mirror-mounting base and a detector-mounting base. Also, a holographic element is mounted on the top of the sidewall of the body frame. The mirror-mounting base and the detector-mounting base are made of a resin, wherein each base is integrally formed with the base plate of the body frame and is separated from the sidewall of the body frame.

摘要翻译： 本发明提供了一种全息激光型半导体激光器件，其构造为使得即使由于温度或湿度吸收的升高使其封装件膨胀，光学元件的构型也几乎不变。 在半导体激光装置中，由绝缘树脂构成的主体框架包含半导体激光元件，反射镜，用于读取信号的光检测元件，反射镜安装基座和检测器安装基座。 此外，全息元件安装在身体框架的侧壁的顶部上。 反射镜安装基座和检测器安装基座由树脂制成，其中每个基座与主体框架的基板一体地形成并且与主体框架的侧壁分离。

公开(公告)号：US06989596B2

公开(公告)日：2006-01-24

申请号：US09987010

申请日：2001-11-13

申请人： Tetsuyoshi Inoue ,  Kazunori Matsubara

发明人： Tetsuyoshi Inoue ,  Kazunori Matsubara

IPC分类号： H01L23/34

CPC分类号： H01S5/02212 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/83192 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01S5/02272 ,  H01S5/024 ,  H01L2924/00

摘要： Silver paste is applied to a stem, and a semiconductor laser chip is mounted onto the stem on which the silver paste has been applied. Next, the semiconductor laser chip mounted on the stem, while kept pressurized toward the stem with a collet, is heated to make the silver paste temporarily cured, by which the semiconductor laser chip is fixed onto the stem. Then, after a temporary curing step, the silver paste is finally cured within a thermostat. The semiconductor laser device thus manufactured is low in thermal resistance and reduced in variations of operating current and prevented from short-circuiting of the semiconductor laser chip.

公开(公告)号：US06983002B2

公开(公告)日：2006-01-03

申请号：US10677030

申请日：2003-09-30

申请人： Hideshi Koizumi ,  Ayumi Yagi ,  Kazunori Matsubara ,  Nobumasa Kaneko

发明人： Hideshi Koizumi ,  Ayumi Yagi ,  Kazunori Matsubara ,  Nobumasa Kaneko

IPC分类号： H01S3/04

CPC分类号： G11B7/123 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01S5/02208 ,  H01S5/02248 ,  H01S5/02276 ,  H01L2924/00014

摘要： A semiconductor laser device, with which a compact and thin optical pickup can be realized, is provided. On the top surface of a supporting member, there is formed an element mounting area for mounting a series of elements including a semiconductor laser element, and a light detecting element which detects a laser beam emitted from the semiconductor laser element and reflected by a surface of an outside optical disc so as to be re-entered. An optical path from the semiconductor laser element to the surface of the optical disc includes a vertical optical path advancing from the element mounting area of the supporting member in an approximately vertical upward direction. On a pair of right and left opposing ends of the supporting member, arcuate curved outer surfaces are formed, respectively, so as to fit the supporting member into an installation hole, for a semiconductor laser device, having arcuate curved inner surfaces. These curved outer surfaces are formed of arcs having the vertical optical path as the central axes, and are so formed that the curvature radiuses of the right and left arcs are different.

摘要翻译： 提供了一种半导体激光器件，通过该半导体激光器件可以实现紧凑和细小的光学拾取器。 在支撑构件的顶面上，形成有用于安装包括半导体激光元件的一系列元件的元件安装区域和检测从半导体激光元件发射并被表面反射的激光束的光检测元件 外部光盘以便重新进入。 从半导体激光元件到光盘表面的光路包括从支撑部件的元件安装区域向大致垂直向上方向前进的垂直光路。 在支撑构件的一对左右相对的端部，分别形成弧形弯曲的外表面，以将支撑构件装配到具有弧形弯曲内表面的半导体激光装置的安装孔中。 这些弯曲的外表面由具有垂直光路作为中心轴的弧形成，并且形成为使得左右弧的曲率半径不同。

公开(公告)号：US06899936B2

公开(公告)日：2005-05-31

申请号：US10233298

申请日：2002-08-30

申请人： Hirotoshi Takemori ,  Kazunori Matsubara

发明人： Hirotoshi Takemori ,  Kazunori Matsubara

IPC分类号： G02B5/32 ,  B29C33/38 ,  B29L11/00 ,  B29L17/00 ,  G03F7/00 ,  G03H1/20 ,  G11B7/00 ,  G11B7/135 ,  G11B7/22 ,  B32B3/02

CPC分类号： G03F7/0017 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/001 ,  G11B7/22 ,  Y10T428/21

摘要： A fine pattern of an optical device formed by the Photo-Polymer method has a groove 100, a side wall 100a of which is sloped against a surface of stamper 18. The slope angle θ of the side wall 100a satisfies the following relational expression: Tan−1(4×h×w1−0.2)

摘要翻译： 通过光聚合法形成的光学器件的精细图案具有凹槽100，侧壁100a倾斜于压模18的表面。侧壁100a的倾斜角度θ满足以下关系式 ：Tan>>> the groove the the the the the the the the the the the the;;;;;;;;;;;;;;;;;;;; 和w 1：由侧壁100a形成的突出部分的顶部的宽度。 在光学装置中形成的毛刺减少，从而提高了光学装置的批量生产率。