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公开(公告)号:US20070138127A1
公开(公告)日:2007-06-21
申请号:US11636622
申请日:2006-12-11
申请人: Ko Onodera , Satoshi Kurimoto , Yoji Tozawa , Shirou Ootsuki
发明人: Ko Onodera , Satoshi Kurimoto , Yoji Tozawa , Shirou Ootsuki
IPC分类号: H01B13/00
CPC分类号: H01G13/006 , H01L21/4867 , H01L23/49805 , H01L24/11 , H01L2224/1131 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01082 , H05K3/403 , Y10T29/43
摘要: An element forming an electronic component has a first face and a second face facing each other, and a third face adjacent to each of the first face and the second face. A method of forming an external electrode of the electronic component involves a pre-formation step, first to third formation steps, and an electrode formation step. The pre-formation step is to apply a conductive paste onto the third face and to evaporate at least a part of a liquid contained in the applied conductive paste, to form a precoat portion expected to become a part of a third electrode portion. The first formation step is to apply the conductive paste from a direction opposite to the first face, onto the first face to form a first electrode portion. The second formation step is to apply the conductive paste from a direction opposite to the second face, onto the second face to form a second electrode portion. The third formation step is to apply the conductive paste onto the third face so as to cover the precoat portion, to form the third electrode portion. The electrode formation step is to dry the element to form the external electrode consisting of the first electrode portion, the second electrode portion, and the third electrode portion. The first electrode portion, the second electrode portion, and the third electrode portion are formed so as to connect with each other.
摘要翻译: 形成电子部件的元件具有彼此相对的第一面和第二面以及与第一面和第二面中的每一个相邻的第三面。 形成电子部件的外部电极的方法包括预成形工序,第一〜第三形成工序以及电极形成工序。 预成形步骤是将导电浆料涂敷在第三面上,蒸发所涂敷的导电浆料中含有的液体的至少一部分,形成预期成为第三电极部分的一部分的预涂部分。 第一形成步骤是将导电膏从与第一面相反的方向涂覆到第一面上以形成第一电极部分。 第二形成步骤是将导电膏从与第二面相反的方向涂覆到第二面上以形成第二电极部分。 第三形成步骤是将导电膏涂覆到第三面以覆盖预涂部分,以形成第三电极部分。 电极形成步骤是干燥元件以形成由第一电极部分,第二电极部分和第三电极部分组成的外部电极。 第一电极部分,第二电极部分和第三电极部分形成为彼此连接。
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公开(公告)号:US07106161B2
公开(公告)日:2006-09-12
申请号:US11149190
申请日:2005-06-10
申请人: Yoji Tozawa , Hidekazu Sato , Kunihiko Kawasaki , Yoshinori Mochizuki , Satoru Okamoto , Kouzou Sasaki , Michiru Ishifune , Shinichi Sato , Katsumi Abe , Shuumi Kumagai
发明人: Yoji Tozawa , Hidekazu Sato , Kunihiko Kawasaki , Yoshinori Mochizuki , Satoru Okamoto , Kouzou Sasaki , Michiru Ishifune , Shinichi Sato , Katsumi Abe , Shuumi Kumagai
IPC分类号: H01F5/00
CPC分类号: H01F27/292 , H01F17/0013 , H01F41/10
摘要: A multilayer inductor is provided with a coil part including a coiled conductor and lead conductors, an outer sheath part covering the coil part and having an electrical isolation, and external electrodes electrically connected to the respective lead conductors. The lead conductors are located at both ends of the coiled conductor and have a width identical with that of the coiled conductor. The outer sheath part has two first side faces parallel to the axial direction of the coiled conductor and not adjacent to each other, and a second side face intersecting with the axial direction of the coiled conductor. Each external electrode has a first electrode portion formed throughout a direction perpendicular to the axial direction of the coiled conductor on the first side face. Each external electrode is not substantially formed on the second side face.
摘要翻译: 多层电感器设置有包括线圈导体和引线导体的线圈部分,覆盖线圈部分并具有电隔离的外护套部分以及电连接到各引线导体的外部电极。 引线导体位于线圈导体的两端,其宽度与线圈导体的宽度相同。 外护套部分具有平行于线圈导体的轴向并且彼此不相邻的两个第一侧面和与线圈状导体的轴向相交的第二侧面。 每个外部电极具有在与第一侧面上的线圈导体的轴向垂直的方向上形成的第一电极部分。 每个外部电极基本上不形成在第二侧面上。
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公开(公告)号:US20060006972A1
公开(公告)日:2006-01-12
申请号:US11149190
申请日:2005-06-10
申请人: Yoji Tozawa , Hidekazu Sato , Kunihiko Kawasaki , Yoshinori Mochizuki , Satoru Okamoto , Kouzou Sasaki , Michiru Ishifune , Shinichi Sato , Katsumi Abe , Shuumi Kumagai
发明人: Yoji Tozawa , Hidekazu Sato , Kunihiko Kawasaki , Yoshinori Mochizuki , Satoru Okamoto , Kouzou Sasaki , Michiru Ishifune , Shinichi Sato , Katsumi Abe , Shuumi Kumagai
IPC分类号: H01F5/00
CPC分类号: H01F27/292 , H01F17/0013 , H01F41/10
摘要: A multilayer inductor is provided with a coil part including a coiled conductor and lead conductors, an outer sheath part covering the coil part and having an electrical isolation, and external electrodes electrically connected to the respective lead conductors. The lead conductors are located at both ends of the coiled conductor and have a width identical with that of the coiled conductor. The outer sheath part has two first side faces parallel to the axial direction of the coiled conductor and not adjacent to each other, and a second side face intersecting with the axial direction of the coiled conductor. Each external electrode has a first electrode portion formed throughout a direction perpendicular to the axial direction of the coiled conductor on the first side face. Each external electrode is not substantially formed on the second side face.
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公开(公告)号:US07113389B2
公开(公告)日:2006-09-26
申请号:US11149304
申请日:2005-06-10
申请人: Michiru Ishifune , Yoji Tozawa , Toshiyuki Anbo , Hidekazu Sato , Shuumi Kumagai
发明人: Michiru Ishifune , Yoji Tozawa , Toshiyuki Anbo , Hidekazu Sato , Shuumi Kumagai
CPC分类号: H01G2/065 , H01F17/0013 , H01F27/292 , H05K3/3442 , H05K2201/09154 , H05K2201/10636 , Y02P70/611 , Y02P70/613 , Y10T29/417
摘要: A multilayer inductor has a rectangular parallelepiped element body and its length in the lengthwise direction (L), length in the direction of height (H), and length in the direction of width (W) are L≦0.6 mm, H≦0.3 mm, and W≦0.3 mm, respectively. Terminal electrodes are provided so as to cover the vertices of the element body and come round to the side face from the end faces on both sides. The radius of curvature R of the vertex of the terminal electrode is set to a value being 10% or more and 20% or less of H or W.
摘要翻译: 多层电感器具有长方体元件体,其长度方向(L)的长度,高度方向的长度(H)和宽度方向的长度(W)的长度L <= 0.6mm,H <= 0.3mm,W <= 0.3mm。 端子电极被设置成覆盖元件主体的顶点并从两侧的端面到达侧面。 端子电极的顶点的曲率半径R被设定为H或W的10%以上且20%以下的值。
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公开(公告)号:US20060007640A1
公开(公告)日:2006-01-12
申请号:US11149304
申请日:2005-06-10
申请人: Michiru Ishifune , Yoji Tozawa , Toshiyuki Anbo , Hidekazu Sato , Shuumi Kumagai
发明人: Michiru Ishifune , Yoji Tozawa , Toshiyuki Anbo , Hidekazu Sato , Shuumi Kumagai
IPC分类号: H01G9/00
CPC分类号: H01G2/065 , H01F17/0013 , H01F27/292 , H05K3/3442 , H05K2201/09154 , H05K2201/10636 , Y02P70/611 , Y02P70/613 , Y10T29/417
摘要: A multilayer inductor has a rectangular parallelepiped element body and its length in the lengthwise direction (L), length in the direction of height (H), and length in the direction of width (W) are L≦0.6 mm, H≦0.3 mm, and W≦0.3 mm, respectively Terminal electrodes are provided so as to cover the vertices of the element body and come round to the side face from the end faces on both sides. The radius of curvature R of the vertex of the terminal electrode is set to a value being 10% or more and 20% or less of H or W.
摘要翻译: 多层电感器具有长方体元件体,其长度方向(L)的长度,高度方向的长度(H)和宽度方向的长度(W)的长度L <= 0.6mm,H <= 0.3mm,W <= 0.3mm。端子电极被设置成覆盖元件主体的顶点并从两侧的端面到达侧面。 端子电极的顶点的曲率半径R被设定为H或W的10%以上且20%以下的值。
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公开(公告)号:US5414300A
公开(公告)日:1995-05-09
申请号:US301186
申请日:1994-09-06
申请人: Yoji Tozawa , Shizuki Hashimoto , Tetsuya Yamamoto
发明人: Yoji Tozawa , Shizuki Hashimoto , Tetsuya Yamamoto
CPC分类号: H01L23/10 , H01L23/04 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L24/45 , H01L24/48 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/16195 , H01L2924/16787 , Y10T428/12646 , Y10T428/12701
摘要: In a ceramic lid for sealing a semiconductor device mount portion of a ceramic package substrate having a semiconductor device mounted thereon, a seal layer disposed in an outer peripheral edge portion of a lid is formed by a solder comprising 2 to 15 wt % of Bi, 2.0 to 6.0 wt % of Sn, 0.5 to 2.0 wt % of In, 0.5 to 2.0 wt % of Ag and the balance of Pb, through an Ag--Pt system underlying metallized layer. A semiconductor package comprising a semiconductor package substrate and a lid is sealed by the lid.
摘要翻译: 在用于密封安装有半导体器件的陶瓷封装衬底的半导体器件安装部分的陶瓷盖中,通过包含2至15重量%的Bi的焊料形成设置在盖的外周边缘部分中的密封层, 2.0〜6.0重量%的Sn,0.5〜2.0重量%的In,0.5〜2.0重量%的Ag,余量为Pb,通过Ag-Pt体系下面的金属化层。 包括半导体封装基板和盖子的半导体封装被盖子密封。
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