公开(公告)号：US07683261B2

公开(公告)日：2010-03-23

申请号：US11750889

申请日：2007-05-18

申请人： James R. Kesler ,  Laurence Virgil Feight

发明人： James R. Kesler ,  Laurence Virgil Feight

IPC分类号： H02G15/08

CPC分类号： H05K5/069

摘要： An article for providing a sealing engagement between an electronic component and an encapsulate material is provided, wherein the electronic component extends from the encapsulate material. The article includes a housing including at least one opening for receiving the electronic component. The housing is filled with an encapsulate material such that it provides a seal between the housing and the electrical component. A sealing member is further disposed between the encapsulate material and the housing. A compression member is provided which exerts force onto the sealing member such that the sealing member engages the encapsulate material to provide a sealing engagement therebetween, and thereby provide a secondary seal between the housing and the electronic component.

摘要翻译： 提供了一种用于在电子部件和封装材料之间提供密封接合的物品，其中电子部件从封装材料延伸。 所述物品包括壳体，所述壳体包括用于接收所述电子部件的至少一个开口。 壳体填充有密封材料，使得其在壳体和电气部件之间提供密封。 密封构件还设置在封装材料和壳体之间。 提供了一种压缩构件，其向密封构件施加力，使得密封构件接合密封材料以在其间提供密封接合，从而在壳体和电子部件之间提供次级密封。

公开(公告)号：US20070267210A1

公开(公告)日：2007-11-22

申请号：US11750889

申请日：2007-05-18

申请人： James R. Kesler ,  Laurence Virgil Feight

发明人： James R. Kesler ,  Laurence Virgil Feight

IPC分类号： H01J15/00

CPC分类号： H05K5/069

摘要： An article for providing a sealing engagement between an electronic component and an encapsulate material is provided, wherein the electronic component extends from the encapsulate material. The article includes a housing including at least one opening for receiving the electronic component. The housing is filled with an encapsulate material such that it provides a seal between the housing and the electrical component. A sealing member is further disposed between the encapsulate material and the housing. A compression member is provided which exerts force onto the sealing member such that the sealing member engages the encapsulate material to provide a sealing engagement therebetween, and thereby provide a secondary seal between the housing and the electronic component.

摘要翻译： 提供了一种用于在电子部件和封装材料之间提供密封接合的物品，其中电子部件从封装材料延伸。 所述物品包括壳体，所述壳体包括用于接收所述电子部件的至少一个开口。 壳体填充有密封材料，使得其在壳体和电气部件之间提供密封。 密封构件还设置在封装材料和壳体之间。 提供了一种压缩构件，其向密封构件施加力，使得密封构件接合密封材料以在其间提供密封接合，从而在壳体和电子部件之间提供次级密封。