公开(公告)号：US20050096794A1

公开(公告)日：2005-05-05

申请号：US10697731

申请日：2003-10-29

申请人： Pyongwon Yim ,  Satish Sundar ,  Vinay Shah ,  Mario Silvetti ,  Douglas Kitajima ,  Venkatesh Babu ,  Visweswaren Sivaramakrishnan ,  Indrajit Lahiri ,  Surinder Bedi

发明人： Pyongwon Yim ,  Satish Sundar ,  Vinay Shah ,  Mario Silvetti ,  Douglas Kitajima ,  Venkatesh Babu ,  Visweswaren Sivaramakrishnan ,  Indrajit Lahiri ,  Surinder Bedi

IPC分类号： G06F19/00 ,  H01L21/00 ,  H01L21/677 ,  H01L21/68

CPC分类号： H01L21/67259 ,  H01L21/67766 ,  H01L21/681

摘要： A robotic positioning system that cooperates with a sensing system to correct robot motion is provided. The sensing system is decoupled from the sensors used conventionally to control the robot's motion, thereby providing repeatable detection of the robot's true position. In one embodiment, the positioning system includes a robot, a controller, a motor sensor and a decoupled sensor. The robot has at least one motor for manipulating a linkage controlling the displacement of a substrate support coupled thereto. The motor sensor is provides the controller with motor actuation information utilized to move the substrate support. The decoupled sensor provides information indicative of the true position the substrate support that may be utilized to correct the robot's motion.

摘要翻译： 提供了与传感系统配合以校正机器人运动的机器人定位系统。 感测系统与常规用于控制机器人运动的传感器分离，从而提供机器人真实位置的可重复检测。 在一个实施例中，定位系统包括机器人，控制器，马达传感器和去耦传感器。 机器人具有至少一个用于操纵联动装置的电动机，控制联接到其上的衬底支架的位移。 马达传感器为控制器提供用于移动基板支架的马达驱动信息。 解耦传感器提供指示可用于校正机器人运动的基板支撑件的真实位置的信息。

公开(公告)号：US20050172905A1

公开(公告)日：2005-08-11

申请号：US10775769

申请日：2004-02-05

申请人： Andrzej Kaszuba ,  Sophia Velastegui ,  Visweswaren Sivaramakrishnan ,  Pyongwon Yim ,  Mario Silvetti ,  Tom Cho ,  Indrajit Lahiri ,  Surinder Bedi

发明人： Andrzej Kaszuba ,  Sophia Velastegui ,  Visweswaren Sivaramakrishnan ,  Pyongwon Yim ,  Mario Silvetti ,  Tom Cho ,  Indrajit Lahiri ,  Surinder Bedi

IPC分类号： C23C16/00 ,  C23C16/44 ,  H01L21/00

CPC分类号： H01L21/67126 ,  C23C16/4401

摘要： In one embodiment, the invention is a guard ring for reducing particle entrapment along a moveable shaft of a substrate support. In one embodiment, the guard ring comprises a substantially annular guard ring positioned within a step formed in a sleeve that circumscribes the shaft. The guard ring is positioned to substantially seal a gap separating the shaft from the sleeve, so that the amount of particles and foreign matter that travel within or become trapped in the gap is substantially reduced. In another embodiment, a guard ring comprises a base portion having an inner perimeter and an outer perimeter, a first flange coupled to the inner perimeter, a second flange coupled to the outer perimeter, and a continuous channel separating the first flange from the second flange. The first flange is adapted to function as a spring that accommodates displacement of the shaft.

摘要翻译： 在一个实施例中，本发明是用于减少沿基板支撑件的可移动轴的颗粒捕获的保护环。 在一个实施例中，保护环包括大致环形的保护环，其定位在形成在套筒内的步骤中，该套筒环绕轴。 保护环被定位成基本上密封将轴与套筒分开的间隙，使得在间隙内行进或被捕获在间隙中的颗粒和异物的量显着减少。 在另一个实施例中，保护环包括具有内周边和外周边的基部，连接到内周边的第一凸缘，联接到外周边的第二凸缘以及将第一凸缘与第二凸缘分开的连续通道 。 第一凸缘适于用作容纳轴的位移的弹簧。

公开(公告)号：US20130032084A1

公开(公告)日：2013-02-07

申请号：US13483002

申请日：2012-05-29

申请人： Visweswaren Sivaramakrishnan ,  Tirunelveli S. Ravi ,  Quoc Vinh Truong ,  Jean R. Vatus ,  Visweswaren Sivaramakrishnan

发明人： Visweswaren Sivaramakrishnan ,  Tirunelveli S. Ravi ,  Andrzej Kaszuba ,  Quoc Vinh Truong ,  Jean R. Vatus

IPC分类号： C30B25/14 ,  C30B25/12

CPC分类号： C30B25/14 ,  C30B25/105 ,  C30B25/12 ,  C30B25/165 ,  C30B25/20 ,  C30B29/06 ,  H01L21/02381 ,  H01L21/0245 ,  H01L21/02513 ,  H01L21/02532 ,  H01L21/0262 ,  H01L31/1804

摘要： A system for depositing thin single crystal silicon wafers by epitaxial deposition in a silicon precursor depletion mode with cross-flow deposition may include: a substrate carrier with low total heat capacity, high emissivity and small volume; a lamp module with rapid heat-up, efficient heat production, and spatial control over heating; and a manifold designed for cross-flow processing. Furthermore, the substrate carrier may include heat reflectors to control heat loss from the edges of the carrier and/or heat chokes to thermally isolate the carrier from the manifolds, allowing independent temperature control of the manifolds. The carrier and substrates may be configured for deposition on both sides of the substrates—the substrates having release layers on both sides and the carriers being configured to have equal process gas flow over both surfaces of the substrate. High volume may be addressed by a deposition system comprising multiple mini-batch reactors.

摘要翻译： 通过在具有交叉流沉积的硅前体耗尽模式中通过外延沉积沉积薄单晶硅晶片的系统可以包括：具有低总热容量，高发射率和小体积的基板载体; 具有快速升温，高效热量生产和加热空间控制的灯模块; 以及设计用于交叉流处理的歧管。 此外，衬底载体可以包括热反射器，以控制从载体和/或热扼流器的边缘的热损失，以将载体与歧管热隔离，允许对歧管进行独立的温度控制。 载体和基底可以被配置用于在基底的两侧上沉积 - 在两侧上具有释放层的基底和载体构造成在基底的两个表面上具有相等的工艺气流。 高体积可以由包括多个微型间歇反应器的沉积系统来解决。

公开(公告)号：US20100215872A1

公开(公告)日：2010-08-26

申请号：US12392448

申请日：2009-02-25

申请人： Visweswaren Sivaramakrishnan ,  Kedarnath Sangam ,  Tirunelveli S. Ravi ,  Andrzej Kaszuba ,  Quoc Vinh Truong

发明人： Visweswaren Sivaramakrishnan ,  Kedarnath Sangam ,  Tirunelveli S. Ravi ,  Andrzej Kaszuba ,  Quoc Vinh Truong

IPC分类号： C23C16/56

CPC分类号： C23C16/481 ,  C23C16/0209 ,  C23C16/455 ,  C23C16/4582 ,  C23C16/46 ,  C23C16/463 ,  C23C16/54 ,  C30B25/105 ,  C30B25/12 ,  C30B29/06

摘要： An epitaxial reactor enabling simultaneous deposition of thin films on a multiplicity of wafers is disclosed. During deposition, a number of wafers are contained within a wafer sleeve comprising a number of wafer carrier plates spaced closely apart to minimize the process volume. Process gases flow preferentially into the interior volume of the wafer sleeve, which is heated by one or more lamp modules. Purge gases flow outside the wafer sleeve within a reactor chamber to minimize wall deposition. In addition, sequencing of the illumination of the individual lamps in the lamp module may further improve the linearity of variation in deposition rates within the wafer sleeve. To improve uniformity, the direction of process gas flow may be varied in a cross-flow configuration. Combining lamp sequencing with cross-flow processing in a multiple reactor system enables high throughput deposition with good film uniformities and efficient use of process gases.

摘要翻译： 公开了一种能够在多个晶片上同时沉积薄膜的外延反应器。 在沉积期间，许多晶片被包含在晶片套筒内，其包括间隔开的多个晶片承载板，以最小化处理体积。 工艺气体优先流入由一个或多个灯模块加热的晶片套筒的内部容积。 吹扫气体在反应器室内的晶片套筒外部流动，以最小化壁沉积。 此外，灯模组中各灯的照明顺序可以进一步提高晶片套筒内沉积速率变化的线性。 为了改善均匀性，工艺气体流动的方向可以在横流构型中变化。 将灯排序与多反应器系统中的交叉流处理相结合，可实现高通量沉积，具有良好的膜均匀性和有效利用工艺气体。

公开(公告)号：US20090044753A1

公开(公告)日：2009-02-19

申请号：US12255638

申请日：2008-10-21

申请人： Deenesh Padhi ,  Chiu Chan ,  Sudha Rathi ,  Ganesh Balasubramanian ,  Jianhua Zhou ,  Karthik Janakiraman ,  Martin J. Seamons ,  Visweswaren Sivaramakrishnan ,  Derek R. Witty ,  Hichem M'Saad

发明人： Deenesh Padhi ,  Chiu Chan ,  Sudha Rathi ,  Ganesh Balasubramanian ,  Jianhua Zhou ,  Karthik Janakiraman ,  Martin J. Seamons ,  Visweswaren Sivaramakrishnan ,  Derek R. Witty ,  Hichem M'Saad

IPC分类号： H01L21/30

CPC分类号： C23C16/45565 ,  C23C16/0254 ,  C23C16/26 ,  C23C16/4404

摘要： An article having a protective coating for use in semiconductor applications and methods for making the same are provided. In certain embodiments, a method of coating an aluminum surface of an article utilized in a semiconductor processing chamber is provided. The method comprises providing a processing chamber; placing the article into the processing chamber; flowing a first gas comprising a carbon source into the processing chamber; flowing a second gas comprising a nitrogen source into the processing chamber; forming a plasma in the chamber; and depositing a coating material on the aluminum surface. In certain embodiments, the coating material comprises an amorphous carbon nitrogen containing layer. In certain embodiments, the article comprises a showerhead configured to deliver a gas to the processing chamber.

摘要翻译： 提供了具有用于半导体应用的保护涂层的制品及其制造方法。 在某些实施例中，提供了在半导体处理室中使用的制品的铝表面的涂覆方法。 该方法包括提供处理室; 将物品放入处理室; 将包含碳源的第一气体流入所述处理室; 将包含氮源的第二气体流入所述处理室; 在室内形成等离子体; 以及在铝表面上沉积涂层材料。 在某些实施方案中，涂层材料包含无定形含碳氮层。 在某些实施例中，制品包括构造成将气体输送到处理室的喷头。

公开(公告)号：US07354288B2

公开(公告)日：2008-04-08

申请号：US11145258

申请日：2005-06-03

申请人： Kazutoshi Maehara ,  Visweswaren Sivaramakrishnan ,  Kentaro Wada ,  Mark A. Fodor ,  Andrzei Kaszuba

发明人： Kazutoshi Maehara ,  Visweswaren Sivaramakrishnan ,  Kentaro Wada ,  Mark A. Fodor ,  Andrzei Kaszuba

IPC分类号： H01R4/60

CPC分类号： C23C16/4586 ,  H01L21/68757

摘要： A substrate support comprises a ceramic disc with an electrode that is chargeable through an electrode terminal. An electrical connector connects an external power source to the electrode terminal. The electrical connector has a pair of opposing pincer arms, a groove sized to fit around the electrode terminal, and a pair of through holes to receive a tightening assembly capable of tightening the opposing pincer arms about the electrode terminal.

摘要翻译： 衬底支撑件包括具有可通过电极端子充电的电极的陶瓷盘。 电连接器将外部电源连接到电极端子。 电连接器具有一对相对的钳形臂，尺寸适于围绕电极端子的凹槽和一对通孔，用于接收能够围绕电极端子紧固相对的夹持臂的紧固组件。

公开(公告)号：US20050150452A1

公开(公告)日：2005-07-14

申请号：US10757021

申请日：2004-01-14

申请人： Soovo Sen ,  Mark Fodor ,  Martin Seamons ,  Priya Kulkarni ,  Visweswaren Sivaramakrishnan ,  Sudha Rathi ,  Tsutomu Shimayama ,  Thomas Nowak ,  Wendy Yeh

发明人： Soovo Sen ,  Mark Fodor ,  Martin Seamons ,  Priya Kulkarni ,  Visweswaren Sivaramakrishnan ,  Sudha Rathi ,  Tsutomu Shimayama ,  Thomas Nowak ,  Wendy Yeh

IPC分类号： C23C16/44 ,  C30B25/14 ,  C23C16/00

CPC分类号： C23C16/4412

摘要： The present invention provides a process kit for a semiconductor processing chamber. The processing chamber is a vacuum processing chamber that includes a chamber body defining an interior processing region. The processing region receives a substrate for processing, and also supports equipment pieces of the process kit. The process kit includes a pumping liner configured to be placed within the processing region of the processing chamber, and a C-channel liner configured to be placed along an outer diameter of the pumping liner. The pumping liner and the C-channel liner have novel interlocking features designed to inhibit parasitic pumping of processing or cleaning gases from the processing region. The invention further provides a semiconductor processing chamber having an improved process kit, such as the kit described. In one arrangement, the chamber is a tandem processing chamber.

摘要翻译： 本发明提供了一种用于半导体处理室的处理套件。 处理室是真空处理室，其包括限定内部处理区域的室主体。 处理区域接收用于处理的基板，并且还支持处理套件的设备件。 该处理套件包括构造成放置在处理室的处理区域内的泵送衬套，以及构造成沿着泵送衬套的外径放置的C形通道衬套。 泵送衬管和C通道衬管具有新颖的互锁特征，其设计用于抑制来自处理区域的处理或清洁气体的寄生泵送。 本发明还提供了一种具有改进的处理工具的半导体处理室，例如所述的套件。 在一种布置中，室是串联处理室。

公开(公告)号：US06783118B2

公开(公告)日：2004-08-31

申请号：US09919633

申请日：2001-07-31

申请人： Visweswaren Sivaramakrishnan ,  John M. White

发明人： Visweswaren Sivaramakrishnan ,  John M. White

IPC分类号： B01F304

CPC分类号： C23C16/4481 ,  B01F3/022 ,  Y10S261/65

摘要： The disclosure relates to a vaporizer valve which accepts a carrier gas and a pressurized liquid and forms a mixture of the carrier gas and vaporized liquid. An internal cavity receives the carrier gas through a carrier aperture and the liquid through a liquid aperture, and the mixed gas and vapor are exhausted out of the cavity via a third aperture. A moveable diaphragm disposed adjacent to the liquid aperture forms a vaporization region having a pressure gradient. The liquid passing through this pressure gradient vaporizes due to expansion. By controlling the diaphragm position with a feedback control circuit responsive to a liquid flow rate monitor, the liquid flow rate may be controlled independently of the carrier gas flow rate.

摘要翻译： 本公开涉及一种蒸发器阀，其接收载气和加压液体并形成载气和汽化液体的混合物。 内腔通过载体孔接收载气，液体通过液体孔接收，并且混合气体和蒸气经由第三孔排出空腔。 邻近液体孔设置的可移动隔膜形成具有压力梯度的蒸发区域。 通过该压力梯度的液体由于膨胀而蒸发。 通过利用响应于液体流速监测器的反馈控制电路来控制隔膜位置，可以独立于载气流量来控制液体流速。

公开(公告)号：US06224681B1

公开(公告)日：2001-05-01

申请号：US08574999

申请日：1995-12-19

申请人： Visweswaren Sivaramakrishnan ,  John M. White

发明人： Visweswaren Sivaramakrishnan ,  John M. White

IPC分类号： C23C1600

CPC分类号： C23C16/4481 ,  B01F3/022 ,  Y10S261/65

摘要： The disclosure relates to a vaporizer valve which accepts a carrier gas and a pressurized liquid and forms a mixture of the carrier gas and vaporized liquid. An internal cavity receives the carrier gas through a carrier aperture and the liquid through a liquid aperture, and the mixed gas and vapor are exhausted out of the cavity via a third aperture. A moveable diaphragm disposed adjacent to the liquid aperture forms a vaporization region having a pressure gradient. The liquid passing through this pressure gradient vaporizes due to expansion. By controlling the diaphragm position with a feedback control circuit responsive to a liquid flow rate monitor, the liquid flow rate may be controlled independently of the carrier gas flow rate.

摘要翻译： 本公开涉及一种蒸发器阀，其接收载气和加压液体并形成载气和汽化液体的混合物。 内腔通过载体孔接收载气，液体通过液体孔接收，并且混合气体和蒸气经由第三孔排出空腔。 邻近液体孔设置的可移动隔膜形成具有压力梯度的蒸发区域。 通过该压力梯度的液体由于膨胀而蒸发。 通过利用响应于液体流速监测器的反馈控制电路来控制隔膜位置，可以独立于载气流量来控制液体流速。

公开(公告)号：US6132517A

公开(公告)日：2000-10-17

申请号：US804505

申请日：1997-02-21

申请人： Visweswaren Sivaramakrishnan ,  Tirunelveli S. Ravi ,  Kramadhati V. Ravi

发明人： Visweswaren Sivaramakrishnan ,  Tirunelveli S. Ravi ,  Kramadhati V. Ravi

IPC分类号： H01L21/677 ,  C23C14/56 ,  C23C16/458 ,  H01L21/02 ,  H01L21/205 ,  H01L21/683 ,  C23C16/00

CPC分类号： H01L21/6831 ,  C23C14/568 ,  C23C16/4586

摘要： A dual wafer processing apparatus (4) includes a chamber housing (14) defining an interior and having upper, lower and central portions (18, 20, 16). An electrostatic chuck (34) has electrostatic chucking surfaces (38, 40) on opposite sides. The chuck is rotatably mounted within the chamber housing so that the chucking surfaces face the upper and lower portions of the chamber housing. After a wafer (36) is positioned on a chucking surface, electrostatic forces are used to maintain the wafer secured to the chucking surface. The chuck is then rotated 180.degree. to permit placement of a second wafer on the second chucking surface. Processing of the two wafers occurs simultaneously. Electrostatic chucking surfaces could be replaced by mechanical wafer clamps.

摘要翻译： 双晶片处理设备（4）包括限定内部并具有上部，下部和中心部分（18,20,16）的腔室壳体（14）。 静电吸盘（34）在相对侧具有静电吸附表面（38,40）。 卡盘可旋转地安装在腔室壳体内，使得卡盘表面面对腔室壳体的上部和下部。 在将晶片（36）定位在卡盘表面上之后，使用静电力来保持晶片固定在卡盘表面上。 然后将卡盘旋转180°以允许将第二晶片放置在第二卡盘表面上。 两个晶片的处理同时发生。 静电吸盘表面可以用机械晶片夹来代替。