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11.
公开(公告)号:US5115090A
公开(公告)日:1992-05-19
申请号:US503401
申请日:1990-03-30
申请人: Krishna G. Sachdev , John P. Hummel , Ranee W. Kwong , Robert N. Lang , Leo L. Linehan , Harbans S. Sachdev
发明人: Krishna G. Sachdev , John P. Hummel , Ranee W. Kwong , Robert N. Lang , Leo L. Linehan , Harbans S. Sachdev
IPC分类号: C08G73/10 , C08L79/08 , H01L21/312 , H01L23/29 , H01L23/498 , H01L23/532 , H05K1/00
CPC分类号: H01L23/5329 , C08G73/1014 , H01L23/293 , H01L23/49894 , H01L2924/0002 , H05K3/4676
摘要: Viscosity stable, essentially gel-free linear polyamic acids are provided by a process utilizing offset stoichiometry. Polyimides formed from such polyamic acids have low TCE and low dielectric constants.Methods for improved adhesion of polyimides are also disclosed.