公开(公告)号：US07882464B1

公开(公告)日：2011-02-01

申请号：US11354280

申请日：2006-02-13

Applicant: Steffen Rochel ,  David Overhauser ,  Gregory Steele ,  Kung Hsu

Inventor： Steffen Rochel ,  David Overhauser ,  Gregory Steele ,  Kung Hsu

IPC: G06F17/50

CPC classification number: G06F17/5036 ,  G06F2217/78

Abstract: Disclosed are systems and methods for electrical verification of integrated circuits. Methodologies are described for verification of the power and ground distribution systems (PDS) for system-on-a-chip (SoC) and the verification of the interaction of the PDS with the behavior of integrated circuits.

Abstract translation: 公开了用于集成电路的电气验证的系统和方法。 描述了用于验证片上系统（SoC）的功率和地面分布系统（PDS）的方法以及PDS与集成电路的行为的相互作用的验证。

公开(公告)号：US08370779B1

公开(公告)日：2013-02-05

申请号：US13009826

申请日：2011-01-19

Applicant: Steffen Rochel ,  David Overhauser ,  Gregory Steele ,  Kung Hsu

Inventor： Steffen Rochel ,  David Overhauser ,  Gregory Steele ,  Kung Hsu

IPC: G06F17/50

CPC classification number: G06F17/5036 ,  G06F2217/78

Abstract: Disclosed are systems and methods for electrical verification of integrated circuits. Methodologies are described for verification of the power and ground distribution systems (PDS) for system-on-a-chip (SoC) and the verification of the interaction of the PDS with the behavior of integrated circuits.

公开(公告)号：US08370778B1

公开(公告)日：2013-02-05

申请号：US13009823

申请日：2011-01-19

Applicant: Steffen Rochel ,  David Overhauser ,  Gregory Steele ,  Kung Hsu

Inventor： Steffen Rochel ,  David Overhauser ,  Gregory Steele ,  Kung Hsu

IPC: G06F17/50

CPC classification number: G06F17/5036 ,  G06F2217/78

Abstract: Disclosed are systems and methods for electrical verification of integrated circuits. Methodologies are described for verification of the power and ground distribution systems (PDS) for system-on-a-chip (SoC) and the verification of the interaction of the PDS with the behavior of integrated circuits.

公开(公告)号：US06858939B1

公开(公告)日：2005-02-22

申请号：US09681776

申请日：2001-06-03

Applicant: Steven Teig ,  David Overhauser ,  Akira Fujimura

Inventor： Steven Teig ,  David Overhauser ,  Akira Fujimura

IPC: H01L23/528 ,  H01I23/48

CPC classification number: H01L23/528 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit has a metal layer that includes conductors to provide interconnectivity for components of the integrated circuit chip. The metal layer is divided into at least two sections, such that a first section has a preferred direction and the second section has a preferred wiring direction that is different from the first preferred direction. The first and second preferred directions on a single metal layer may consist of any direction. The metal layer may be divided into more than two sections, wherein each section has a preferred wiring direction. Wiring geometries for multi-level metal layers are also disclosed.

Abstract translation: 集成电路具有包括为集成电路芯片的组件提供互连的导体的金属层。 金属层被分成至少两个部分，使得第一部分具有优选的方向，并且第二部分具有不同于第一优选方向的优选的布线方向。 单个金属层上的第一和第二优选方向可由任何方向组成。 金属层可以被分成多于两个部分，其中每个部分具有优选的布线方向。 还公开了多层金属层的接线几何形状。