摘要:
Provided are photosensitive resin compositions comprising a polyamic compound having, at each terminal thereof, a specific actinic ray-sensitive functional group which has substituent groups each having a photopolymerizable carbon-carbon double bond, a photosensitive auxiliary having a photopolymerizable functional group and a solvent. The photosensitive resin compositions of the invention are excellent in resist properties such as sensitivity and good in storage stability and can provide a film small in residual stress.
摘要:
Methods for preparing a green sheet and a glass ceramic substrate are herein disclosed.The object of these methods is to make green sheets and glass ceramic substrates practically acceptable, the green sheets and the glass ceramic substrates having a low dielectric constant and low scattering in properties, and the method comprises the steps of preparing a mixture of hollow silica microspheres, borosilicate glass powder and ceramic powder as a principal ingredient, adding a plasticizer, a binder and a solvent to the mixture, kneading the mixture and forming it into a green sheet, wherein the shell-thickness of the hollow silica microspheres is controlled so that the specific gravity of the hollow silica microspheres is approximately equal to that of the solvent and wherein an inorganic substance containing aluminum as a constituent element such as alumina, mullite or aluminum nitride is used as the ceramic powder for forming the green sheet; or the method further comprises the step of calcining the resulting green sheet.
摘要:
A method of forming a ceramic circuit substrate allowing mounting of high integration density semiconductor elements. The method provides a multilayered ceramic circuit substrate having via holes formed with high accuracy and high integration density wiring patterns by forming metallic conductive balls to connect the conductive wiring patterns of upper and lower layers; a ball arranging plate having many holes placing on a green sheet uniformly in close contact; filling the holes of the plate with the embedding the conductive balls by pressure into the green sheet; and thereafter baking the green sheet individually or in a stacked layered arrangement.
摘要:
A flexible optical connector suitable for use in an optical backplane for interconnecting optical circuit boards, and methods of making the optical connector, are disclosed. The flexible optical connector comprises a plurality of waveguides on two or more levels providing a plurality of light paths that allow light communication between optical circuit boards. The optical connector can be manufactured separately from the backplane and thereafter mounted on the backplane. The backplane of the present invention may also have a mounting structure for removably retaining and positioning optical circuit board and may, optionally, include electrical traces for providing electrical interconnections between the circuit boards.
摘要:
Optical couplers having attachment features are disclosed. A typical coupler according to the present invention couples an optical signal from an optical fiber to a channel waveguide by overlapping the cores of the optical fiber and channel waveguide along a portion of their waveguide lengths, with a spacing distance between the cores of not more than 20 microns for single-mode light coupling, and not more than 100 microns for multi-mode light coupling. This is in contrast to a prior art coupler, which seeks to position the ends of the two cores in a facing relationship. In embodiments according to the present invention, attachment films may be disposed in the overlapping regions to provide advantageous coupling arrangements and new types of opto-electric devices.
摘要:
An all-optical one-by-N optical switch is provided that has fewer components, is easier to control and has fewer optical losses that prior art one-by-N optical switches. An optical switch of the present invention includes an active deflection element formed from an electro-optical material to deflect an optical input from a single input to a selected one of N outputs. In one embodiment of the present invention, a single active deflection element at the input deflects an optical signal across a waveguide that commonly connects the N outputs. The N optical outputs include passive optical elements that are aligned with the deflected optical signal to accept a signal and provide it to a selected optical output. The optical switch can either be monolithic, where the optical material are all electro-optical materials, or can be hybrid, having separately formed components, such as the common waveguide, adhered to the substrate on which the optical switch is formed.
摘要:
Compact optical devices and methods of constructing the same are disclosed. The optical devices are formed with perpendicular orientations to the surface of a supporting layer (e.g., substrate), and have three-dimensional structures rather than planar structures. The optical devices can be formed with high density on supporting layers without the need for several built-up layers. Maintaining the processing temperatures within the cure profiles of polymer optical layers is readily achieved.
摘要:
A flexible optical connector suitable for use in an optical backplane for interconnecting optical circuit boards, and methods of making the optical connector, are disclosed. The flexible optical connector comprises a plurality of waveguides on two or more levels providing a plurality of light paths that allow light communication between optical circuit boards. The optical connector can be manufactured separately from the backplane and thereafter mounted on the backplane. The backplane of the present invention may also have a mounting structure for removably retaining and positioning optical circuit board and may, optionally, include electrical traces for providing electrical interconnections between the circuit boards.
摘要:
Disclosed are reconfigurable optical interconnections for opto-electronic processors in general, and for scalable computer architectures and scalable network servers in particular. The optical-signal interconnects are adaptable, or reconfigurable, during the normal operation of the processor. A large number of optical-signal interconnects may be provided among the components of the processor while using a small number of light transmitters and/or light receivers.
摘要:
The present invention provides an optical bridge for interconnecting optical networking components and methods of making optical bridges that include a waveguide that are compatible with semiconductor processing steps. The optical bridge of the present invention has less optical losses and is less affected by misalignment that prior art interconnections. The waveguide is formed of a curable optical material that spans optically active areas of two components. In one embodiment of the present invention, one optical component is an optical circuit board and the connected optical component is an electro-optical integrated circuit package containing light emitting or light receiving elements. The method provides a curable optical liquid to the components, bringing the components together to form a continuous optical liquid between the components, and curing the optical liquid.