公开(公告)号：US20070221335A1

公开(公告)日：2007-09-27

申请号：US11389559

申请日：2006-03-23

申请人： Florent Haddad ,  Alain Gaudon

发明人： Florent Haddad ,  Alain Gaudon

IPC分类号： B29C65/00

CPC分类号： H01L21/68707 ,  Y10T156/1702

摘要： A device for contact by adhesion to a glass or semiconductor plate (wafer) surface or the like is disclosed. The device includes a base including a flexible material equipped with an adhesive contact surface intended to be attached to said plate surface by adhesion, and means for differentiating the separation resistance between said adhesive contact surface made of the flexible material and the surface of the plate, in a direction perpendicular to the adhesive contact surface and in a direction parallel to said adhesive contact surface.

摘要翻译： 公开了一种通过粘合到玻璃或半导体板（晶片）表面等来接触的装置。 该装置包括：基部，其包括柔性材料，该柔性材料配备有用于通过粘合附着到所述板表面的粘合剂接触表面;以及用于区分所述柔性材料制成的粘合剂接触表面与所述板的表面之间的分离电阻的装置， 在垂直于粘合剂接触表面的方向上并且在平行于所述粘合剂接触表面的方向上。