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公开(公告)号：US20190097102A1
公开(公告)日：2019-03-28
申请号：US16133206
申请日：2018-09-17
Applicant: NICHIA CORPORATION
Inventor： Teppei KUNIMUNE , Masafumi KURAMOTO
Abstract: A semiconductor device includes a base, a semiconductor element mounted on the base, a porous metal sintered body and a sealing member. The porous metal sintered body is provided on the base in an area different from an area on which the semiconductor element is mounted. The sealing member covers the semiconductor element. The sealing member is placed inside the porous metal sintered body.
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