公开(公告)号：US20120202606A1

公开(公告)日：2012-08-09

申请号：US13023837

申请日：2011-02-09

申请人： Tae Hong Kim ,  Hun Hee Lee ,  Il Hun Ryu ,  Jose P. Da Silva

发明人： Tae Hong Kim ,  Hun Hee Lee ,  Il Hun Ryu ,  Jose P. Da Silva

IPC分类号： F16D3/205

CPC分类号： F16D3/2055

摘要： A constant velocity joint for a drive system comprises: a tripod housing coupled to the first rotating shaft and having a plurality of guide grooves therein, each guide groove extending in an axial direction of the tripod housing; a spider coupled to the second rotating shaft and having a plurality of trunnions, each trunnion positioned in a corresponding guide groove of the tripod housing; and a spherical roller disposed between the trunnion and the guide groove of the tripod housing, and a plurality of needle rollers disposed between the trunnion and spherical roller. Each spherical roller is in angular contact with the guide groove of the tripod housing with two contact points displaced relative to a pitch circle diameter line of the tripod housing. The ratio of the length (CL) between two contact points of tripod housing groove to the length (SL) between two edges of spherical roller is between 0.5 and 0.85, and the ratio of the radius (TGR2) of the guide groove of the tripod housing to the radius (SRR) of the spherical roller is between 1.1 and 1.4.

摘要翻译： 用于驱动系统的恒速接头包括：三脚架壳体，其联接到第一旋转轴并且在其中具有多个引导槽，每个引导槽沿三角架壳体的轴向方向延伸; 一个与所述第二旋转轴相连并且具有多个耳轴的蜘蛛，每个耳轴位于所述三脚架壳体的对应引导槽中; 以及设置在三角架壳体的耳轴和引导槽之间的球面滚子，以及设置在耳轴和球面滚子之间的多个滚针。 每个球面滚子与三脚架壳体的引导槽成角度接触，两个接触点相对于三脚架外壳的节圆直径线移动。 三脚架壳体槽的两个接触点与球面滚子的两个边缘之间的长度（SL）之间的长度（CL）的比率在0.5和0.85之间，并且三脚架的引导槽的半径（TGR2） 外壳到球面滚子的半径（SRR）在1.1和1.4之间。

公开(公告)号：US08096887B2

公开(公告)日：2012-01-17

申请号：US12360837

申请日：2009-01-27

申请人： Seung Tark Oh ,  Tae Hong Kim

发明人： Seung Tark Oh ,  Tae Hong Kim

IPC分类号： F16D3/223

CPC分类号： F16D3/223 ,  F16D3/2245 ,  F16D2003/22303 ,  Y10S464/906

摘要： A constant velocity joint for a drive system comprises: an outer race having a plurality of guide grooves formed in an axial direction in the inner spherical surface of the outer race; an inner race having a plurality of guide grooves formed in an axial direction in the outer spherical surface of the inner race, said guide grooves of the outer race and the inner race together forming a plurality of ball guide tracks; a plurality of balls disposed in the ball guide tracks; and a cage installed between the inner spherical surface of the outer race and the outer spherical surface of the inner race, said cage having a plurality of windows for retaining the balls therein. Each guide groove of the outer race is shaped to have a longitudinal cross section formed with two circular regions with different centers, a first circular region disposed at a first lateral side of the outer race and a second circular region disposed at a second lateral side of the outer race, and a linear region tangentially extending between these two circular regions, and each guide groove of the inner race is shaped to have a longitudinal cross section formed with two circular regions with different centers, a first circular region disposed at a first lateral side of the inner race and a second circular region disposed at a second lateral side of the inner race, and a linear region tangentially extending between these two circular regions.

摘要翻译： 一种用于驱动系统的等速万向节包括：具有在外圈的内球面中沿轴向形成的多个引导槽的外座圈; 内圈，其具有在所述内圈的外球面中沿轴向形成的多个引导槽，所述外座圈的所述引导槽和所述内座圈一起形成多个滚珠导轨; 设置在所述球导轨中的多个球; 以及安装在所述外圈的内球面与所述内座圈的外球面之间的保持架，所述保持架具有用于将球保持在其中的多个窗。 外圈的每个引导槽成形为具有形成有具有不同中心的两个圆形区域的纵向截面，设置在外圈第一侧面的第一圆形区域和设置在外圈的第二侧面处的第二圆形区域 所述外圈和在所述两个圆形区域之间切向延伸的线性区域，并且所述内座圈的每个引导槽的形状为具有形成有具有不同中心的两个圆形区域的纵向截面，设置在第一侧面处的第一圆形区域 并且设置在所述内圈的第二横向侧的第二圆形区域和在这两个圆形区域之间切向延伸的线性区域。

公开(公告)号：US20110070955A1

公开(公告)日：2011-03-24

申请号：US12563029

申请日：2009-09-18

申请人： Seung Tark Oh ,  Tae Hong Kim

发明人： Seung Tark Oh ,  Tae Hong Kim

IPC分类号： F16D3/224

CPC分类号： F16D3/223 ,  F16D3/229 ,  F16D3/24

摘要： A constant velocity joint for a drive system comprises: an outer joint member having a plurality of inwardly facing outer ball grooves, the outer ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern; an inner joint member disposed inside the outer joint member and having a plurality of outwardly facing inner ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern, each inner ball groove of the inner joint member being coupled with a corresponding outer ball groove of the outer joint member generally in crossed pair; and a cage having circumferentially displaced cage windows to accommodate a plurality of balls therein. The groove patterns of the ball grooves can be a combination of skewed grooves and non-linear grooves, a combination of non-linear grooves such as a curved groove or a compositely shaped groove, or a combination of linear grooves and non-linear grooves.

摘要翻译： 用于驱动系统的等速万向节包括：具有多个向内的外球槽的外接头构件，所述外滚珠槽由第一组槽组成，第二组槽具有复合或非直线槽图案; 内侧接头构件，其设置在所述外侧接头构件的内侧，具有由第一组槽构成的多个向外的内部球槽和具有复合或非直线槽形状的第二组槽，所述内侧接头的每个内部球槽 构件与所述外接头构件的相应的外球槽大致交叉对地联接; 以及笼，其具有周向移位的笼窗，以容纳其中的多个球。 球槽的凹槽图案可以是斜槽和非直线槽的组合，诸如弯曲凹槽或复合形状凹槽的非线性凹槽的组合，或者线性凹槽和非直线凹槽的组合。

公开(公告)号：US20100216558A1

公开(公告)日：2010-08-26

申请号：US12390943

申请日：2009-02-23

申请人： Seung Tark Oh ,  Tae Hong Kim

发明人： Seung Tark Oh ,  Tae Hong Kim

IPC分类号： F16D3/00

CPC分类号： F16D3/2245 ,  F16D2003/22303 ,  Y10S464/906

摘要： A fixed type constant velocity joint comprises: an outer race having an inner spherical surface, and a plurality of guide grooves formed in an axial direction in the inner spherical surface of the outer race, each guide groove having a circular shape in a longitudinal cross section thereof; an inner race having an outer spherical surface, and a plurality of guide grooves formed in an axial direction in the outer spherical surface of the inner race, each guide groove having a circular shape in a longitudinal cross section thereof, said guide grooves of the outer race and said guide grooves of the inner race together forming a plurality of ball guide tracks arranged around the circumference of the joint; a plurality of balls disposed in the ball guide tracks; and a cage installed between the inner spherical surface of the outer race and the outer spherical surface of the inner race, said cage having a plurality of windows for retaining the balls therein. The ball guide tracks include first tracks and second tracks with different groove configurations and having dual, multiple, or differentiated center offsets with smaller offsets applied to the tracks having relatively large ball movements and larger offsets applied to the tracks having relatively small ball movements as the joint is articulated for assembling.

摘要翻译： 一种固定式等速万向节包括：具有内球面的外圈和在所述外座圈的内球面中沿轴向形成的多个引导槽，每个引导槽的纵截面为圆形 的; 具有外球面的内圈和在内圈的外球面中沿轴向形成的多个引导槽，每个引导槽在其纵向截面中具有圆形形状，所述外槽的引导槽 所述内圈的所述引导槽一起形成围绕所述接头的圆周布置的多个滚珠导轨; 设置在所述球导轨中的多个球; 以及安装在所述外圈的内球面与所述内座圈的外球面之间的保持架，所述保持架具有用于将球保持在其中的多个窗。 球导轨包括具有不同凹槽构造的第一轨道和第二轨道，并且具有双重，多个或微分的中心偏移，其较小偏移应用于具有相对较大球运动的轨迹，并且较大的偏移应用于具有相对小的球运动的轨迹， 接头铰接用于组装。

公开(公告)号：US20100099219A1

公开(公告)日：2010-04-22

申请号：US12255146

申请日：2008-10-21

申请人： Bhyrav M. Mutnury ,  Moises Cases ,  Tae Hong Kim ,  Nanju Na

发明人： Bhyrav M. Mutnury ,  Moises Cases ,  Tae Hong Kim ,  Nanju Na

IPC分类号： H01L21/50 ,  H01B13/34 ,  B32B37/02 ,  H01L23/48

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/025 ,  H05K3/242 ,  H05K3/382 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T156/10 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： Plating stub resonance in a circuit board may be mitigated by increasing surface roughness of the plating stub conductor. Roughening the plating stub increases its resistance due to the skin effect at higher frequencies, which decreases the quality factor of the transmission line and consequently increases the damping factor, to reduce any resonance that would occur in the plating stub as formed prior to roughening. The surface roughness can be increased in a variety of ways, including chemical processes, by selectively applying a laser beam, or by applying an etch-resistance material in selected locations.

摘要翻译： 可以通过增加电镀短截线导体的表面粗糙度来减轻电路板中的短截线共振。 粗化电镀短截线由于在较高频率下的皮肤效应而增加其电阻，这降低了传输线的品质因数并因此增加了阻尼因子，以减少在粗糙化之前形成的电镀短截线中发生的任何共振。 表面粗糙度可以通过各种方式增加，包括化学工艺，通过选择性地施加激光束，或通过在选定位置施加耐蚀刻材料。

公开(公告)号：US20100060527A1

公开(公告)日：2010-03-11

申请号：US12207597

申请日：2008-09-10

申请人： Tae Hong Kim ,  Moises Cases ,  Bhyrav Murthy Mutnury ,  Stephen H. Carman

发明人： Tae Hong Kim ,  Moises Cases ,  Bhyrav Murthy Mutnury ,  Stephen H. Carman

IPC分类号： H01Q1/38 ,  H01Q1/00 ,  H01P11/00

CPC分类号： H01Q15/006 ,  H01P1/2005 ,  Y10T29/49016

摘要： Embodiments of the invention include electromagnetic band gap (EBG) structures having undulating branches to tune the resulting stopband. A periodically patterned structure of conductive patches are interconnected by the undulating branches. Physical parameters of the undulating branches, such as the number of undulations or “turns” per branch, may be selected to tune the stopband in an effort to achieve a target stopband. Accordingly, embodiments of the invention also include methods of designing and manufacturing an EBG structure using undulating branches.

摘要翻译： 本发明的实施例包括具有起伏分支以调谐所得到的阻带的电磁带隙（EBG）结构。 导电贴片的周期性图案化结构通过起伏的分支相互连接。 可以选择起伏分支的物理参数，例如每个分支的起伏数或“转动次数”，以调整阻带以努力实现目标阻挡带。 因此，本发明的实施例还包括使用起伏分支设计和制造EBG结构的方法。

公开(公告)号：US08500566B2

公开(公告)日：2013-08-06

申请号：US12702757

申请日：2010-02-09

申请人： Seung Tark Oh ,  Tae Hong Kim

发明人： Seung Tark Oh ,  Tae Hong Kim

IPC分类号： F16D3/223

CPC分类号： F16D3/229

摘要： A constant velocity joint for a drive system comprises an outer joint member and an inner joint member each having a plurality of ball grooves in pairs for accommodating balls therein, the ball grooves consisting of a first group of grooves, each groove of which having a linear groove shape with no skew angle or a skewed groove shape with a relatively smaller skew angle, and a second group of grooves, each groove of which having a skewed groove shape with a relatively larger or regular skew angle. In addition to having the differentiated skew angles in the first and second groups of grooves, a taper angle is provided to the pair of grooves of at least one or both of the first and second groups of grooves in order to reduce the potential risk of ball locking in the grooves. In an alternative embodiment, all the grooves of the outer and inner joint members have a skewed groove shape with a skew angle which is less than the regular skew angle of the conventional cross groove joint, and a taper angle is provided to the pairs of grooves of the outer and inner joint members.

摘要翻译： 用于驱动系统的等速万向节包括外接头构件和内接头构件，每个都具有多个成对的球槽，用于容纳球，所述球槽由第一组凹槽组成，每个凹槽具有线性 没有歪斜角的槽形状或具有相对较小的歪斜角的倾斜槽形状;以及第二组槽，每个槽的斜槽形状具有相对较大或规则的倾斜角。 除了在第一和第二组槽中具有差异的倾斜角之外，锥形角被提供给第一组和第二组凹槽中的至少一个或两个的一对凹槽，以便降低球的潜在风险 锁在槽中。 在替代实施例中，外接头和内接头部件的所有凹槽都具有倾斜的凹槽形状，其倾斜角小于常规横沟接头的规则倾斜角，并且锥形角被提供给成对的凹槽 的外部和内部联接构件。

公开(公告)号：US08389870B2

公开(公告)日：2013-03-05

申请号：US12720386

申请日：2010-03-09

申请人： Kevin Bills ,  Mahesh Bohra ,  Jinwoo Choi ,  Tae Hong Kim ,  Rohan Mandrekar

发明人： Kevin Bills ,  Mahesh Bohra ,  Jinwoo Choi ,  Tae Hong Kim ,  Rohan Mandrekar

IPC分类号： H05K1/11

CPC分类号： H01L23/49822 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/16 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/024 ,  H05K1/0251 ,  H05K1/113 ,  H05K1/144 ,  H05K2201/0187 ,  H05K2201/041 ,  H05K2201/09481 ,  H05K2201/09718 ,  H05K2201/10734 ,  Y10T29/49124 ,  Y10T29/49151 ,  H01L2924/00

摘要： A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.

公开(公告)号：US20120193135A1

公开(公告)日：2012-08-02

申请号：US13446727

申请日：2012-04-13

申请人： Moises Cases ,  Tae Hong Kim ,  Rohan U. Mandrekar ,  Nusrat I. Sherali

发明人： Moises Cases ,  Tae Hong Kim ,  Rohan U. Mandrekar ,  Nusrat I. Sherali

IPC分类号： H05K1/11

CPC分类号： H05K3/0094 ,  H05K1/0234 ,  H05K1/0242 ,  H05K1/0251 ,  H05K1/09 ,  H05K1/167 ,  H05K3/0047 ,  H05K3/244 ,  H05K3/429 ,  H05K2201/0391 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1057 ,  Y10T428/12528

摘要： Example multi-layer printed circuit boards (‘PCBs’) are described as well as methods of making and using such PCBs that include layers of laminate; at least one via hole traversing the layers of laminate, and a via conductor contained within the via hole, the via conductor comprising a used portion and an unused portion, the via conductor comprising copper coated with a metal having a conductivity lower than the conductivity of copper.

摘要翻译： 描述了例如多层印刷电路板（“PCB”），以及制造和使用这种包括层压层的PCB​​的方法; 穿过层压体层的至少一个通孔，以及包含在通孔内的通孔导体，所述通孔导体包括使用部分和未使用部分，所述通孔导体包括涂覆有电导率低于 铜。

公开(公告)号：US20110103030A1

公开(公告)日：2011-05-05

申请号：US12610413

申请日：2009-11-02

申请人： Moises Cases ,  Tae Hong Kim ,  Bhyrav M. Mutnury ,  Nanju Na

发明人： Moises Cases ,  Tae Hong Kim ,  Bhyrav M. Mutnury ,  Nanju Na

IPC分类号： H01L23/52 ,  H01L21/60 ,  H05K7/00

CPC分类号： H01L23/647 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/00014

摘要： Packages and methods for mitigating plating stub effects. The semiconductor package includes an interposer substrate having a first side, a second side, a peripheral edge connecting the first side with the second side, a signal line on the first side, and an electrode pad on the first side. A semiconductor element is mounted on the first side of the interposer substrate. The semiconductor element is connected with the electrode pad by the signal line. A terminating resistor is mounted on the interposer substrate. A plating stub, which is located on the interposer substrate, has a first end portion that terminates near the peripheral edge of the interposer substrate and a second end portion that is electrically connected to the electrode. The first end portion is electrically connected through the terminating resistor to an electrical ground.

摘要翻译： 用于减轻电镀桩效应的包装和方法。 半导体封装包括具有第一侧，第二侧，连接第一侧与第二侧的周边边缘，第一侧上的信号线和第一侧上的电极焊盘的插入器基板。 半导体元件安装在插入器基板的第一侧上。 半导体元件通过信号线与电极焊盘连接。 终端电阻器安装在插入器基板上。 位于内插基板上的电镀短截线具有在中介基板的周缘附近终止的第一端部和与该电极电连接的第二端部。 第一端部通过终端电阻器电连接到电接地。