公开(公告)号：US20220146816A1

公开(公告)日：2022-05-12

申请号：US17094940

申请日：2020-11-11

Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION

Inventor： Donald Di Marzio ,  Stephane Larouche ,  Vesna Radisic ,  Michael R. Hachkowski ,  Jeffrey L. Cavaco ,  Michael Wojtowicz

IPC: G02B26/08 ,  G02B23/06 ,  G02B1/00

Abstract: An optical assembly including a plurality of metamirrors, where each metamirror includes a substrate, a reflective layer formed to the substrate, an array of optical metaelements extending from the reflective layer and an array of micro-actuators coupled to the substrate opposite to the reflective layer. The combination of the micro-actuators are controlled to control the orientation and bending of the metamirrors to set how the metaelements focus a light beam that is reflected off of the reflective layers.

公开(公告)号：US20220020708A1

公开(公告)日：2022-01-20

申请号：US16916644

申请日：2020-07-17

Applicant: Northrop Grumman Systems Corporation

Inventor： Dah-Weih Duan ,  Elizabeth T. Kunkee ,  Stephane Larouche

IPC: H01L23/66 ,  H01P1/203

Abstract: An exemplary semiconductor technology implemented channelized filter includes a dielectric substrate with semiconductor fabricated metal traces on one surface, and input and output ports. A signal trace connected between the input and output port carries the signal to be filtered. Filter traces connect at intervals along the length of the signal trace to provide a reactance that varies with frequency. Ground traces provide a reference ground. A silicon enclosure with semiconductor fabricated cavities has a metal layer deposited over it. The periphery of the enclosure is dimensioned to engage corresponding ground traces about the periphery of the substrate. Walls of separate cavities enclose each of the filter traces to individually surround each thereby providing electromagnetic field isolation. Metal-to-metal conductive bonds are formed between cavity walls that engage the ground traces to establish a common reference ground. The filter traces preferably meander to minimize the footprint area of the substrate.