公开(公告)号：US20120007598A1

公开(公告)日：2012-01-12

申请号：US12833390

申请日：2010-07-09

申请人： Chiung C. Lo ,  Joseph Seeger ,  Martin Lim

发明人： Chiung C. Lo ,  Joseph Seeger ,  Martin Lim

IPC分类号： G01R33/02

CPC分类号： G01R33/0011 ,  G01R33/07 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A micromachined magnetic field sensor integrated with electronics is disclosed. The magnetic field sensors utilize Hall-effect sensing mechanisms to achieve 3-axis sensing. A Z axis sensor can be fabricated either on a device layer or on a conventional IC substrate with the design of conventional horizontal Hall plates. An X and Y axis sensor are constructed on the device layer. In some embodiments, a magnetic flux concentrator is applied to enhance the performance of the magnetic field sensor. In some embodiments, the magnetic field sensors are placed on slope sidewalls to achieve 3-axis magnetic sensing system. In some embodiments, a stress isolation structure is incorporated to lower the sensor offset. The conventional IC substrate and device layer are connected electrically to form a 3-axis magnetic sensing system. The magnetic field sensor can also be integrated with motion sensors that are constructed in the similar technology.

摘要翻译： 公开了一种与电子器件集成的微加工磁场传感器。 磁场传感器利用霍尔效应感测机构实现3轴感测。 Z轴传感器可以在设备层或常规IC基板上制造，具有常规水平霍尔板的设计。 X和Y轴传感器构造在器件层上。 在一些实施例中，施加磁通集中器以增强磁场传感器的性能。 在一些实施例中，磁场传感器被放置在倾斜侧壁上以实现3轴磁感测系统。 在一些实施例中，结合了应力隔离结构以降低传感器偏移。 常规IC基板和器件层电连接以形成3轴磁感测系统。 磁场传感器也可以与以类似技术构造的运动传感器集成。