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    Stressed Substrates For Transient Electronic Systems
    12.
    发明申请
    Stressed Substrates For Transient Electronic Systems 有权
    用于瞬态电子系统的强化衬底

    公开(公告)号：US20150102852A1

    公开(公告)日：2015-04-16

    申请号：US14052348

    申请日：2013-10-11

    Applicant: Palo Alto Research Center Incorporated

    Inventor： Scott J. H. Limb ,  Gregory L. Whiting ,  Sean R. Garner ,  JengPing Lu ,  Dirk DeBruyker

    IPC: H03K19/177

    CPC classification number: H03K19/17768 ,  H01L21/64 ,  H01L21/71 ,  H01L23/14 ,  H01L23/57 ,  H01L27/00 ,  H01L27/12 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A stressed substrate for transient electronic systems (i.e., electronic systems that visually disappear when triggered to do so) that includes one or more stress-engineered layers that store potential energy in the form of a significant internal stress. An associated trigger mechanism is also provided that, when triggered, causes an initial fracture in the stressed substrate, whereby the fracture energy nearly instantaneously travels throughout the stressed substrate, causing the stressed substrate to shatter into multiple small (e.g., micron-sized) pieces that are difficult to detect. The internal stress is incorporated into the stressed substrate through strategies similar to glass tempering (for example through heat or chemical treatment), or by depositing thin-film layers with large amounts of stress. Patterned fracture features are optionally provided to control the final fractured particle size. Electronic systems built on the substrate are entirely destroyed and dispersed during the transience event.

    Abstract translation: 用于瞬态电子系统的应力衬底（即，当触发时视觉消失的电子系统）包括一个或多个以显着的内部应力的形式存储势能的应力设计层。 还提供了一种相关联的触发机构，其在被触发时引起应力基底中的初始断裂，由此断裂能几乎瞬时地穿过受压基底，导致受应力的基底碎裂成多个小（例如，微米级） 这很难发现。 通过与玻璃回火（例如通过热或化学处理）相似的策略，或者通过沉积具有大量应力的薄膜层，将内部应力结合到受压基板中。 可选地提供图案化的断裂特征以控制最终的断裂的粒度。 在基板上构建的电子系统在瞬态事件期间被完全破坏和分散。

    Micro assembler with fine angle control
    13.
    发明授权
    Micro assembler with fine angle control 有权

    公开(公告)号：US12051610B2

    公开(公告)日：2024-07-30

    申请号：US18126520

    申请日：2023-03-27

    Applicant: PALO ALTO RESEARCH CENTER INCORPORATED

    Inventor： JengPing Lu ,  Eugene M. Chow ,  David K. Biegelsen

    IPC: H01L21/68 ,  H01L21/683

    CPC classification number: H01L21/68 ,  H01L21/6831 ,  H01L21/6833

    Abstract: First and second chiplets are positioned along a surface to respectively cover first and second electrodes. The first electrode is activated to cause an attraction force between the first electrode and the first chiplet. The second electrode is deactivated allowing the second chiplet to rotate on the surface. While the first electrode is activated and the second electrode is deactivated, a rotation field is applied to cause the second chiplet to be oriented at a desired orientation angle, the first chiplet being prevented from rotating by the attraction force.

    CHIPLET LOADER FOR MICROASSEMBLER
    14.
    发明公开
    CHIPLET LOADER FOR MICROASSEMBLER 审中-公开

    公开(公告)号：US20240242993A1

    公开(公告)日：2024-07-18

    申请号：US18097543

    申请日：2023-01-17

    Applicant: PALO ALTO RESEARCH CENTER INCORPORATED

    Inventor： JengPing Lu ,  David K. Biegelsen ,  Sourobh Raychaudhuri ,  Bradley Rupp ,  Eugene M. Chow

    IPC: H01L21/677

    CPC classification number: H01L21/67721 ,  H01L21/67736

    Abstract: A micro-assembly system includes a reservoir that stores a supply of chiplets suspended in a suspension fluid. Each of the chiplets has a bottom major surface that defines a right side down orientation. The system includes a delivery surface or belt that delivers the chiplets from the reservoir to an assembly surface. The system includes a micro assembler that may arrange the first subset of the chiplets in a pattern on the assembly surface. The micro assembler moves the first subset of chiplets towards a subsequent assembly stage. The micro assembler has an array of field generators fixed relative to the assembly surface that move the first subset of the chiplets along the assembly surface in response to signals applied to each of the field generators.

    METHOD AND SYSTEM FOR MASS ASSEMBLY OF THIN-FILM MATERIALS
    15.
    发明申请
    METHOD AND SYSTEM FOR MASS ASSEMBLY OF THIN-FILM MATERIALS 有权

    公开(公告)号：US20220388295A1

    公开(公告)日：2022-12-08

    申请号：US17889514

    申请日：2022-08-17

    Applicant: PALO ALTO RESEARCH CENTER INCORPORATED

    Inventor： JengPing Lu ,  Eugene M. Chow ,  Sourobh Raychaudhuri

    IPC: B32B37/00 ,  B32B37/10 ,  B32B38/04 ,  B32B38/18

    Abstract: A system includes a separation tool that separates a carrier wafer to form a plurality of chiplet carriers. The carrier wafer having sheets of thin film material attached. A sensor and processor of the system determine an orientation of the portions of the sheets of thin film material relative to the chiplets to determine a mapping therebetween. A fluid carrier of the system places the chiplet carriers on an assembly surface in a disordered pattern. The system includes a micro assembler that arranges the chiplet carriers from the disordered pattern to a predetermined pattern based on the mapping. A carrier of the system transfers the portions of the thin film material from the chiplet carriers to a target substrate.

    Transfer substrate utilizing selectable surface adhesion transfer elements
    16.
    发明授权
    Transfer substrate utilizing selectable surface adhesion transfer elements 有权

    公开(公告)号：US10964582B2

    公开(公告)日：2021-03-30

    申请号：US16449844

    申请日：2019-06-24

    Applicant: Palo Alto Research Center Incorporated

    Inventor： Yunda Wang ,  Sourobh Raychaudhuri ,  JengPing Lu

    IPC: H01L21/683 ,  B65G47/90 ,  H01L25/075 ,  H01L33/62

    Abstract: An apparatus includes a transfer substrate with two or more transfer elements. Each of the transfer elements includes an adhesion element having a first surface adhesion at a first temperature and a second surface adhesion at a second temperature. The second surface adhesion less than the first surface adhesion. Each transfer element has a thermal element operable to change a temperature of the adhesion element in response to an input. A controller is coupled to provide the inputs to the thermal elements of the two or more transfer elements to cause a subset of the transfer elements to selectably hold objects to and release the objects from the transfer substrate in response to changes between the first and second surface adhesion of the subset of the transfer elements.

    Capacitive imaging device with active pixels and method
    17.
    发明授权
    Capacitive imaging device with active pixels and method 有权

    公开(公告)号：US10101373B2

    公开(公告)日：2018-10-16

    申请号：US14257566

    申请日：2014-04-21

    Applicant: Palo Alto Research Center Incorporated

    Inventor： JengPing Lu

    IPC: G01R27/26 ,  G06F3/044 ,  G06K9/00 ,  G06F3/041

    Abstract: A capacitive image sensor includes a sensor array having capacitive image pixels. Each pixel has a two-transistor configuration including a pixel selection transistor and a source follower transistor. The pixel selection transistor activates the source follower transistor. The source follower is coupled to a variable capacitance that affects an input impedance of the source follower. An AC current is source is used to interrogate the activated source follower to determine an output impedance of the source follower. The output impedance is a function of the input impedance and the output impedance is representative of the nearness of an object.

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